Solder-Free Chip Component Connection via Mechanical Pressure
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Solution Overview
Problem
Conventional electronic devices with metal terminals face challenges in securely and reliably connecting chip components to conductive terminals, especially under high-temperature conditions or environments with large temperature changes, due to the unreliable solder connections and thermal expansion issues.
Innovation Solution
An electronic device design featuring at least two chip components with terminal electrodes, held by a conductive hold member that connects the chip components without solder using conductive terminal pieces and an intermediate connection piece, ensuring secure and firm connections through pressure and insulation, thereby preventing solder melting and thermal expansion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to connect terminal electrodes and metal terminals, then electrical connection is achieved, but connection reliability deteriorates under high-temperature environments and thermal expansion differences cause connection release
Solution Approach 1:
The invention extracts and eliminates solder from the connection system between terminal electrodes and metal terminals. Instead of using solder, the patent employs a direct mechanical connection structure where terminal electrodes are pressed against metal terminals by a holding member, completely removing the solder material that causes thermal expansion compatibility issues.
Solution Approach 2:
The holding member acts as an intermediary component that applies pressing force to maintain electrical contact between terminal electrodes and metal terminals without requiring solder. This mediator enables reliable connection through mechanical pressure while accommodating thermal expansion differences.
2Reliability
If solder is used to connect terminal electrodes and metal terminals, then electrical connection is achieved, but solder may be melted again by heat transmission during mounting
Solution Approach 1:
The invention removes solder from the connection path between terminal electrodes and metal terminals. By eliminating this heat-conductive material, the system prevents heat transmission from mount portions from melting solder during the mounting process, while maintaining electrical connection through direct mechanical contact.
3Reliability
If multiple chip components are soldered to metal terminals, then electrical connections are established, but the operation becomes complicated and connection reliability decreases
Solution Approach 1:
The invention merges multiple connection functions into a single integrated holding member that simultaneously holds multiple chip components and applies pressing force to all terminal electrode-metal terminal connections. This consolidation simplifies the manufacturing process by eliminating the need for separate soldering operations for each component.
Solution Approach 2:
The invention replaces the complex soldering mechanical process with a simpler pressing mechanism. The holding member applies mechanical pressure to establish and maintain electrical connections, substituting the multi-step soldering operation with a single pressing action that is easier to control and more reliable.
4Reliability
If terminal electrodes and metal terminals are connected by solder, then electrical connection is achieved, but crack may occur from the solder connection part
Solution Approach 1:
The invention extracts solder from the connection system and replaces it with a solder-free mechanical pressing connection. This eliminates the brittle solder material that is prone to cracking, while the flexible holding member and elastic deformation capability of the metal terminal provide crack resistance through controlled deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a secure, reliable, and solder-free connection between chip components and conductive terminals, maintaining stability even in high-temperature environments and reducing the risk of connection failure due to thermal expansion differences.
Implementation Method 1
the chip components and the terminal pieces can be connected under pressure by the hold member, and the chip components and the conductive terminals can be connected securely and firmly
Implementation Method 2
the connection parts between the terminal electrodes of the chip components and the connection piece or the terminal pieces absorb differences in thermal expansion and are not released
Data Source
AI summary
An electronic device includes at least two chip components, a hold member with insulation, a first conductive terminal piece, a second conductive terminal piece, and an intermediate connection piece. The hold member holds the chip components side by side. The intermediate connection piece connects the terminal electrode of one of the chip components and the terminal electrode of the other chip component.