Solder-Free Die Connection to Redistribution Layer
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Solution Overview
Problem
Current multi-chip semiconductor packaging methods face challenges with redistribution layers, including soldering issues that limit reflow thermal budgets and create complexity, especially when placing bridge dies with multiple solder joints, which can lead to inefficiencies and limitations in subsequent thermal processes.
Innovation Solution
A die-first packaging process is adopted, using a solder-free connection with a sputtered titanium-copper alloy and vertically tapered interconnects that extend through redistribution layers, reducing the need for multiple solder joints and allowing for a more compact bridge die architecture with a single bump pitch, and utilizing laser processes for precise via creation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect bridge die to redistribution layers, then electrical connectivity is achieved, but thermal budget constraints and manufacturing complexity increase
Solution Approach 1:
The patent extracts and eliminates the soldering process from the interconnection method. Instead of using solder to connect the bridge die to the redistribution layer, the invention uses direct metallurgical bonding through vertically tapered interconnects that extend through the redistribution layer, thereby removing the harmful soldering step while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the mechanical/chemical soldering system with a metallurgical bonding system. The vertically tapered interconnects create direct metal-to-metal contact between the bridge die and the substrate, substituting the solder joint mechanism with a more reliable metallurgical bond that eliminates thermal budget constraints.
2Reliability
If multiple solder joints are used for bridge die connection, then electrical connectivity is achieved, but reflow thermal budget is limited
Solution Approach 1:
The patent removes multiple solder joints from the connection architecture. By using vertically tapered interconnects that extend through the redistribution layer, the invention achieves electrical connectivity through a single metallurgical bond interface, eliminating the need for multiple solder joints and their associated thermal constraints.
Solution Approach 2:
Instead of connecting the bridge die to redistribution layers through multiple solder joints from above, the patent inverts the approach by having vertically tapered interconnects extend upward from the substrate through the redistribution layer to contact the bridge die, achieving connectivity through a single bond interface.
3Ease of manufacture
If traditional die packaging order is used with die placed last, then assembly is simplified, but connectivity options are limited
Solution Approach 1:
The patent performs preliminary actions by pre-forming vertically tapered interconnects that extend through the redistribution layer before the bridge die is placed. This preliminary preparation of the connection pathway enables versatile connectivity options while maintaining assembly simplicity, as the interconnects are already in position to receive the bridge die.
Solution Approach 2:
The patent adds a vertical dimension to the interconnection architecture with vertically tapered interconnects that extend through the redistribution layer. This three-dimensional approach provides enhanced connectivity options compared to traditional planar connections, allowing the bridge die to be connected from above while maintaining assembly simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a more efficient and compact multi-die package with reduced thermal constraints, improved connectivity, and simplified manufacturing, enhancing the reliability and performance of semiconductor devices by eliminating solder-related limitations and allowing for better thermal management.
Implementation Method 1
a sputtered titanium-copper alloy
Implementation Method 2
utilizing laser processes for precise via creation
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a semiconductor device. In selected examples, the semiconductor device may include two semiconductor dies, a redistribution layer, an interconnect bridge coupled between the two semiconductor dies and located vertically between the two semiconductor dies and the redistribution layer, and a metallic connection passing through the redistribution layer and coupled to one or more of the two semiconductor dies in a solder-free connection.