Solder-Free Rigid-Flex Circuit Assembly with Plated Interconnections
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Solution Overview
Problem
The electronics industry faces challenges in manufacturing rigid flex circuit assemblies due to the limitations of traditional soldering methods, including high temperatures required for lead-free solders, susceptibility to mechanical failure, and environmental impact, which complicates the assembly process and reduces reliability.
Innovation Solution
The development of a method for manufacturing rigid-flex circuit assemblies using thermally and electrically conductive substrates with electronic components interconnected via flexible sections without solder, utilizing plated interconnections and low-temperature processes to reduce weight, enhance thermal dissipation, and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead-free solder is used for interconnection, then reliability is improved by eliminating lead, but manufacturing complexity increases due to higher temperatures required
Solution Approach 1:
The patent removes solder entirely from the interconnection process, extracting the problematic element that requires high-temperature processing. Instead of using lead-free solder which demands complex high-temperature manufacturing, the invention uses direct mechanical interlocking of component leads with circuit board holes, eliminating the soldering step and its associated manufacturing complexity while maintaining reliable electrical connections.
2Ease of manufacture
If high temperatures are used for lead-free soldering, then interconnection is achieved, but component damage increases and reliability decreases
Solution Approach 1:
The patent replaces the thermal field (high-temperature soldering) with a mechanical field (direct mechanical interlocking). Component leads are inserted into circuit board holes and secured through mechanical means such as deformation or interference fitting, eliminating the need for high-temperature thermal processing that damages components. This mechanical substitution achieves reliable interconnection without exposing components to damaging temperatures.
3Ease of manufacture
If solder is used for assembly, then electrical interconnection is achieved, but assembly weight increases
Solution Approach 1:
The patent extracts solder material from the assembly, completely eliminating its weight contribution. By using direct mechanical interlocking of component leads with the circuit board structure, the invention removes the additional solder material that would otherwise be required for electrical interconnection, thereby reducing overall assembly weight while maintaining electrical connectivity through the mechanical contact path.
4Productivity
If traditional soldering processes are used, then mass joining of components is achieved, but manufacturing cost increases due to lead-free requirements
Solution Approach 1:
The patent removes solder from the manufacturing process entirely, eliminating the need for expensive lead-free solder materials and the complex high-temperature soldering equipment required to process them. The direct mechanical interlocking method uses standard component leads and circuit board structures that are already part of the base assembly, dramatically reducing material costs and manufacturing complexity while maintaining mass production capability through efficient mechanical insertion and securing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in lighter, more reliable, and cost-effective assemblies that avoid high-temperature solder exposure, enabling flexible interconnections and improved thermal management without the need for solder, thus simplifying the manufacturing process and enhancing the reliability of electronic components.
Implementation Method 1
thermally and electrically conductive substrates with electronic components interconnected via flexible sections without solder, utilizing plated interconnections
Implementation Method 2
thermally and electrically conductive substrates with electronic components interconnected via flexible sections without solder, utilizing plated interconnections and low-temperature processes to reduce weight, enhance thermal dissipation
Data Source
AI summary
A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.