Solder Guide Portions for Plate Alignment
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Solution Overview
Problem
The alignment of plate-like members, such as a holding plate and a connection base plate, made of different materials, particularly when one is non-metallic, is challenging due to process errors, especially as the complexity of semiconductor integrated circuits increases, requiring manual fine adjustments that are skill-dependent and prone to errors.
Innovation Solution
A method involving the formation of metal land portions on one plate and corresponding through holes in the other, where solder is melted to create guide portions that align and secure the plates, eliminating the need for manual fine adjustments by forming guide pins and holes that compensate for process errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If guide pin and guide hole are designed at the time of designing of the connection base plate and the holding means, then the structure is simple and easy to manufacture, but process error of the guide hole causes misalignment requiring manual fine adjustment
Solution Approach 1:
The patent applies preliminary action by forming the guide portions on the connection base plate before assembling with the holding means. The guide portions are created by melting solder materials that extend along the circumferential surfaces of the through holes, establishing precise alignment features in advance that compensate for process errors in the guide hole formation.
Solution Approach 2:
The patent utilizes parameter changes by transforming the solder materials from solid state to liquid state through melting, and then back to solid state through solidification. This phase change allows the solder to flow and conform to the through hole geometry, creating precise guide portions that eliminate alignment errors. The key parameter changed is the physical state of the solder material during the formation process.
2Adaptability or versatility
If the number of probes in a probe base plate increases, then the degree of integration of the integrated circuit increases, but manual fine adjustment becomes difficult and requires skill
Solution Approach 1:
The patent applies self-service by designing a system where the guide portions automatically align the holding means with the connection base plate through the engagement of guide portions with through holes. This self-aligning mechanism eliminates the need for manual fine adjustment, allowing the system to compensate for process errors automatically without requiring operator skill or intervention, even as the number of probes increases.
3Reliability
If one plate-like member is made of non-metallic material, then the electrical insulation is improved, but the process accuracy of the guide hole deteriorates
Solution Approach 1:
The patent uses the solder materials as an intermediary substance between the non-metallic holding means and the metallic connection base plate. The solder is applied to the connection base plate, melted to flow into the through holes of the holding means, and solidified to form guide portions. This intermediary material compensates for the poor process accuracy of drilling through holes in non-metallic materials, achieving precise alignment without compromising the electrical insulation properties of the non-metallic holding means.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures accurate alignment of plate-like members without requiring manual fine adjustments, regardless of process errors, enhancing the alignment accuracy and ease of assembly in manufacturing electrical connecting apparatuses like probe cards.
Implementation Method 1
thermally melting the solder materials in the through holes on the land portions to form guide portions extending along circumferential surfaces of the through holes in the corresponding through holes from the land portions by solidification of the solder materials
Data Source
AI summary
One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.