Solder Holding Unit for Semiconductor Heat Spreader Bonding
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Solution Overview
Problem
The existing modular semiconductor apparatus faces challenges in maintaining precise separation dimensions between semiconductor devices and heat spreaders, leading to risks of solder overflow or underfill, which can decrease reliability due to inadequate solder control during bonding.
Innovation Solution
Incorporating a regulating unit, such as spacers or protruding portions, and a holding unit that contains and manages melted solder to ensure consistent solder distribution, preventing underfill and overflow by replenishing or recovering excess solder during the cooling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spacers and protruding portions are provided between the semiconductor device and the heat spreader, then the separation dimension can be controlled, but the precision of the separation dimension is still difficult to increase
Solution Approach 1:
A holding unit is introduced as an intermediary component between the semiconductor device and the heat spreader. This holding unit positively holds the semiconductor device at a predetermined position, thereby precisely controlling the separation dimension. The holding unit acts as a mediator that enables accurate positioning without requiring complex spacer configurations or protruding portions, thus improving separation dimension precision while avoiding excessive structural complexity.
2Ease of manufacture
If a predetermined amount of solder is used for bonding, then the bonding process is simple, but excess solder may overflow or underfill portions may occur
Solution Approach 1:
The holding unit is positioned in advance to define a precise bonding area between the semiconductor device and the heat spreader. By preliminarily establishing the positional relationship and separation dimension through the holding unit, the solder is confined to a specific region during the bonding process. This preliminary positioning action ensures that the predetermined amount of solder is distributed precisely without overflowing or creating underfill portions, thereby maintaining bonding process simplicity while achieving high solder distribution precision.
3Ease of operation
If the separation dimension between the semiconductor device and the heat spreader is not precisely controlled, then the device assembly is easier, but the reliability of the semiconductor apparatus decreases
Solution Approach 1:
The holding unit serves as a mediator that automatically maintains the precise separation dimension between the semiconductor device and the heat spreader during assembly. This intermediary component eliminates the need for complex alignment procedures or precise manual positioning, making the assembly process easier while ensuring reliable and consistent separation dimensions. The holding unit's positive holding function guarantees that the semiconductor device is positioned accurately, thereby maintaining high apparatus reliability without compromising assembly ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of the semiconductor apparatus by maintaining optimal solder distribution, reducing the occurrence of underfill and overflow, thereby improving heat dissipation and thermal fatigue resistance.
Implementation Method 1
a heat spreader (4, 14, 15), bonded to a semiconductor device (2, 3) with an interposed solder layer (9b, 9d)
Implementation Method 2
The holding unit (11) is configured to allow melted solder held in an interior of the holding unit (11) to flow between the holding unit (11) and the containing unit (10)
Data Source
AI summary
According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.