Solder Inspection Feedback Adjusting Correction Ratio

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Solution Overview

Problem

The existing communication between screen printers and solder inspection apparatuses is unreliable due to buffers that put printed circuit boards on standby, leading to excessive corrections and frequent check signals, which affect the accuracy and efficiency of solder printing.

Innovation Solution

A method and apparatus for generating feedback information that considers the number of buffers between the screen printer and the solder inspection apparatus, calculating a correction ratio based on the number of buffers to adjust the correction value and check signal generation, preventing overcorrection and excessive check signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If feedback information is generated without considering the number of buffers, then the inspection process is simple, but excessive correction occurs in the screen printer and check signals occur too frequently

Engineering Contradiction:
Improvefeedback information generation processVSAvoidfeedback information reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The system performs preliminary action by obtaining buffer information in advance before generating feedback information. The controller receives the number of buffers from the screen printer and stores this information for subsequent feedback generation, allowing the system to pre-calculate appropriate correction ratios based on buffer conditions rather than reacting after excessive corrections occur

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by adjusting the correction ratio in feedback information based on the number of buffers. When buffers are detected, the system generates feedback with a reduced correction ratio to prevent overcorrection, while when no buffers are present, it uses a higher correction ratio for faster correction, creating an adaptive feedback mechanism that responds to system conditions

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If the correction ratio is increased to correct solder position errors, then the correction effectiveness is improved, but overcorrection occurs when buffers are present

Engineering Contradiction:
Improvesolder position accuracyVSAvoidcorrection accuracy
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The system applies dynamics by making the correction ratio adjustable and adaptive rather than fixed. The controller dynamically selects between a first correction ratio (when buffers are present) and a second correction ratio (when no buffers are present), allowing the correction strength to change based on real-time system conditions and buffer status

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes parameters by adjusting the correction ratio value based on buffer detection. When buffers are detected, the system uses a reduced correction ratio to prevent overcorrection, while when buffers are not present, it increases the correction ratio to improve correction effectiveness, thereby adapting the correction parameter to system conditions

Inventive Principle:
Principle #35Parameter changes

3Reliability

If check signals are generated frequently to ensure quality control, then the inspection thoroughness is improved, but unnecessary check signals reduce operational efficiency

Engineering Contradiction:
Improvequality control reliabilityVSAvoidoperational efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system performs preliminary action by obtaining buffer information in advance and using it to predict when check signals are necessary. By knowing the buffer status beforehand, the system can avoid generating unnecessary check signals for boards that are already accounted for in the buffer, thereby reducing redundant quality control actions while maintaining thoroughness where needed

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10747198B2Solder inspection apparatus and method of generating feedback information of solder inspection apparatus
Publication Date: 2020.08.18 KOHYOUNG TECH
  • US10747198B2 patent drawing
  • US10747198B2 patent drawing
  • US10747198B2 patent drawing

AI summary

A feedback information generation method for a solder inspection apparatus includes: receiving an input of information on the number of buffers which are disposed between the solder inspection apparatus and a screen printer for printing solder on printed circuit boards and are configured to support the printed circuit boards to be introduced into the solder inspection apparatus so as to put the printed circuit boards on standby; generating feedback information by using the input information and an inspection result of the printed circuit boards by the solder inspection apparatus; and transmitting the feedback information to the screen printer. Feedback information may be generated in consideration of the number of buffers, thereby preventing the feedback information from being excessively generated as well as ensuring the accuracy of the feedback information.