Solder Printing Inspection Reference Shift for Adhesive Self-Alignment
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Solution Overview
Problem
Existing solder printing inspection devices fail to accurately determine the printing quality of solder paste on substrates with thermosetting adhesives, as the self-alignment effect during the reflow process is not sufficiently considered, leading to potential misalignment and poor inspection results.
Innovation Solution
A solder printing inspection device that includes an irradiation unit, imaging unit, and units for generating actual and ideal solder position information, allowing for adjustment of the inspection reference based on the curing temperature of the adhesive, enabling accurate inspection of solder quality by shifting the inspection reference position when the self-alignment effect is exerted or not.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inspection is performed based on offset reference position to account for self-alignment effect, then mounting position accuracy is improved, but inspection accuracy deteriorates when adhesive curing temperature is low
Solution Approach 1:
The inspection reference position is made dynamic rather than fixed. The system automatically adjusts the reference position based on the adhesive curing temperature: when temperature is high (self-alignment occurs), the reference is offset by the self-alignment amount; when temperature is low (no self-alignment), the reference returns to the original position. This dynamic adaptation resolves the contradiction between improving mounting accuracy and maintaining inspection accuracy under different thermal conditions.
Solution Approach 2:
The inspection reference position parameter is changed based on the curing temperature parameter. By monitoring the curing temperature and adjusting the reference position offset accordingly, the system adapts to different process conditions. This parameter coupling allows the inspection system to maintain accuracy across varying thermal environments while still accounting for self-alignment effects when appropriate.
2Ease of operation
If fixed reference position inspection is used, then inspection process simplicity is maintained, but mounting position accuracy deteriorates due to self-alignment effect
Solution Approach 1:
The inspection system performs self-adjustment based on process parameters. By automatically obtaining the curing temperature and calculating the appropriate reference position offset, the system self-corrects for self-alignment effects without requiring manual intervention. This maintains operational simplicity while improving mounting accuracy, as the adjustment happens automatically through programmed logic.
Solution Approach 2:
The system implements feedback by monitoring the curing temperature and using this information to adjust the inspection reference position. The temperature data feeds back into the inspection parameter selection, creating a closed-loop system that automatically adapts to process variations. This feedback mechanism maintains simplicity by automating the adjustment process rather than requiring manual calibration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures accurate inspection of solder quality, preventing misalignment and enhancing manufacturing yield while reducing costs by utilizing inspection data for precise mounting, thus improving manufacturing efficiency.
Implementation Method 1
an irradiation unit configured to irradiate at least the solder with light
Implementation Method 2
an imaging unit configured to take an image of at least the solder irradiated with the light
Implementation Method 3
a thermosetting adhesive may be applied on the printed circuit board
Implementation Method 4
The self-alignment effect is achieved by the function that causes the solder paste molten in the reflow process to wet and spread along the surface of the electrode pattern
Data Source
AI summary
A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.