Solder Joint Resistance Detection Circuit for Array Packages
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Solution Overview
Problem
Existing testing procedures for detecting failed solder joints on array packages are costly, complex, and often only identify failures when a complete disconnect occurs, which can lead to system malfunction due to mechanical fatigue from vibration or thermal cycles.
Innovation Solution
A circuit that applies a second voltage opposite a constant voltage source at a solder joint and monitors the output to detect resistance changes, indicating a failure when the resistance exceeds or falls below a threshold, using a test circuit and monitoring circuit configuration with pull-up or pull-down resistors and a test pulse output driver to rapidly identify joint failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If previous testing procedures are used to detect failed solder joints, then detection capability is provided, but the testing procedures are too costly and overly complex to implement
Solution Approach 1:
The patent extracts the essential detection function from complex testing procedures by using a simple voltage monitoring circuit that applies a test voltage and monitors for failures through basic voltage level detection, eliminating the need for costly and complex equipment while maintaining detection capability
Solution Approach 2:
The patent employs inexpensive test circuits and monitoring circuits that can be easily implemented without expensive equipment, making the testing procedure cost-effective and suitable for routine implementation
2Measurement precision
If previous testing procedures are used to detect failed solder joints, then detection capability is provided, but the testing procedures are overly complex to implement
Solution Approach 1:
The patent extracts the core detection function from complex testing procedures by using a simple voltage monitoring circuit that applies a test voltage and monitors for failures through basic voltage level detection, making the implementation straightforward and easy to manufacture
Solution Approach 2:
The test circuit and monitoring circuit are designed to be self-contained and easy to implement within the array package, allowing for straightforward manufacturing without requiring complex external testing equipment or procedures
3Reliability
If some testing procedures are used, then failures are identified, but only when a complete disconnect occurs
Solution Approach 1:
The patent applies a test voltage through the solder joint and monitors the voltage level to detect resistance changes that indicate partial failures or degradation before complete disconnect occurs, enabling preliminary detection of potential failures
Solution Approach 2:
The monitoring circuit continuously monitors the voltage level at the solder joint and provides feedback when the voltage changes indicate a failure condition, allowing for timely detection of both partial and complete failures
4Reliability
If some testing procedures are used, then failures are identified, but the operation of the array package or the circuit must be interrupted or stopped
Solution Approach 1:
The patent implements a test circuit and monitoring circuit that can operate continuously during normal array package operation, allowing failure detection without interrupting or stopping the operation of the array package or circuit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of solder joint failures with fast response times and low power consumption, allowing for timely repair or replacement before critical interior joints fail, and can be applied to corner pins or other critical connections.
Implementation Method 1
a circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package
Data Source
AI summary
A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package includes: a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and a monitoring circuit for monitoring an output of the test circuit, wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.