Solder Joint Overstress Detection via Temporary Circuit Interruption
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Detecting temporary mechanical overload in electronic devices, particularly field devices used in automation technology, is challenging, especially retrospectively, due to harsh operating conditions that can cause damage.
Innovation Solution
Incorporating a brittle-breaking solder joint in the circuit arrangement of the electronic device, which detects maximum temporary voltage and current interruptions caused by partial brittle fracture under mechanical overload, allowing for self-detection without additional sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If additional vibration and/or impact sensors are used to detect mechanical overload, then detection capability is improved, but device complexity increases
Solution Approach 1:
The circuit arrangement monitors its own operational parameters (voltage and current) to detect mechanical overload conditions. The existing circuit components serve dual purposes: their primary function and the additional function of overload detection, eliminating the need for separate sensing components.
Solution Approach 2:
Existing circuit components are designed to perform multiple functions. The voltage and current monitoring circuits, originally intended for operational control, are also configured to detect mechanical overload conditions by monitoring for characteristic voltage/current interruptions, thereby serving both operational and diagnostic purposes.
2Loss of information
If retrospective detection of mechanical overload is attempted, then damage analysis is improved, but detection reliability deteriorates due to temporary nature of the overload
Solution Approach 1:
The circuit arrangement continuously monitors voltage and current parameters during normal operation, maintaining readiness to detect overload conditions. This continuous preliminary monitoring ensures that when a mechanical overload occurs, the system is already in a state capable of immediate detection and recording, preserving evidence for later analysis.
Solution Approach 2:
The system implements continuous feedback monitoring of voltage and current parameters. When a characteristic interruption pattern indicative of mechanical overload is detected, the system immediately records the event and can trigger alarm signals or protective actions, providing real-time feedback that preserves information for retrospective analysis.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable detection of temporary mechanical overload through reversible partial fractures in solder joints, facilitating retrospective analysis and lifetime prediction based on recorded overload events.
Implementation Method 1
the solder joint undergoes partial brittle fracture. This causes a temporary and noticeable increase in the contact resistance within the circuit arrangement
Implementation Method 2
This may lead to a re-joining of the fracture surfaces of the brittle fractured area of the solder joint, similar to cold welding
Data Source
Figure 1a~3
Figure 4~5
Figure 6
AI summary
The invention relates to an electronic device comprising a circuit arrangement (1). The circuit arrangement (1) is configured to detect an at most temporary voltage and/or current interruption (SU) in the path (2) and to associate it with an at most temporary brittle fracture (SB) of a brittle soldered connection (3), which brittle fracture (SB) is caused by at most temporary mechanical overuse of the electronic device. Therefore, the at most temporary mechanical overuse of the electronic device can be determined using the circuit arrangement (1). The invention furthermore relates to a method for determining mechanical overuse of an electronic device (11).