Wire-to-Solder Joint Adapter With Detachable Terminal Coupling

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Solution Overview

Problem

Conventional adapters for coupling wires to solder joints are costly, cumbersome, and inefficient.

Innovation Solution

An adapter with a solder joint receiving hole and a wire attachment terminal, designed to securely couple a wire to a solder joint using a detachable mechanism, such as crimping or screwing, while allowing for materials with good thermal and electrical conductivity, and featuring an air-escape hole to prevent air entrapment during soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional adapters are used to couple wires to solder joints, then connection reliability is achieved, but cost and device complexity increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidadapter complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The adapter is divided into distinct functional components: a body portion with a receiving hole for the solder joint, and a separate wire attachment terminal. This segmentation allows each component to be optimized independently while maintaining overall reliability, reducing the complexity of the integrated design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The adapter body acts as an intermediary component between the solder joint and the wire attachment terminal. It provides a mechanical and electrical interface that simplifies the coupling process while ensuring reliable connection, eliminating the need for complex direct attachment mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conventional adapters are used to couple wires to solder joints, then connection stability is achieved, but manufacturing cost increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The adapter utilizes materials with specific thermal and electrical conductivity parameters optimized for soldering applications. By selecting materials with appropriate parameter ranges, the adapter achieves stable connections during soldering while maintaining cost-effectiveness through standard material choices rather than expensive specialized materials.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The adapter design employs simple, easily manufactured components that can be produced at low cost. The straightforward geometry and standard material selection enable economical manufacturing while maintaining sufficient durability for the intended application lifecycle.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If air entrapment occurs during soldering, then soldering quality deteriorates, but manufacturing complexity increases without the air-escape hole

Engineering Contradiction:
Improvesoldering qualityVSAvoidadapter structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The air-escape hole extracts the harmful air trapped during soldering from the receiving hole cavity. This simple opening allows air to escape during the soldering process, preventing defects without requiring complex venting mechanisms or multi-component structures.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The adapter incorporates a porous or open-structure feature through the air-escape hole, allowing controlled passage of air during soldering. This porous characteristic enables gas evacuation while maintaining the structural integrity and electrical conductivity of the adapter body.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adapter provides a cost-effective, efficient, and reliable method for connecting wires to solder joints, reducing material stress and ensuring a secure, conductive connection without damaging components.

Implementation Method 1

featuring an air-escape hole to prevent air entrapment during soldering

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

allowing for materials with good thermal and electrical conductivity

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250214166A1Adapter to couple a wire to a solder joint
Publication Date: 2025.07.03 II VI DELAWARE INC
  • US20250214166A1 patent drawing
  • US20250214166A1 patent drawing

AI summary

Embodiments of the present disclosure may comprise an adapter to couple a wire to a solder joint, with the adapter comprising a solder joint receiving hole and a wire attachment terminal.