Electric Pattern Solder Mask for Bridge Suppression
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Solution Overview
Problem
The existing electric apparatuses face challenges in preventing solder bridges during the soldering process, as the flow of soldering material can create electrical bridges between solder balls, leading to shorts and reliability issues.
Innovation Solution
The electric apparatus incorporates electric patterns with pads, electrical traces, and dummy traces arranged in specific configurations, including right-angle orientations and connection lines, along with a solder mask layer with varying surface levels to control the flow of soldering material and prevent bridges. This configuration ensures that the soldering material flows in a specific direction, reducing the likelihood of bridge formation between electric patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering material is applied during the soldering process, then electrical connection between solder balls is achieved, but solder bridges form between adjacent solder balls creating electrical shorts
Solution Approach 1:
The patent introduces a solder mask layer as an intermediary substance between adjacent solder balls. This mask layer selectively covers areas where solder bridges would form, allowing the soldering material to flow and connect solder balls vertically while preventing lateral flow that would create bridges. The mask layer thus mediates between the need for electrical connection and the need to prevent shorts.
Solution Approach 2:
The solder mask layer is applied with varying surface levels - a first mask layer at a higher level covering electrical traces and dummy traces, and a second mask layer at a lower level spaced apart from traces. This local variation in the mask layer's properties (height and coverage) allows precise control over solder material flow in different regions, enabling connection where needed while preventing bridges in critical areas.
2Area of stationary object
If electrical traces are placed close to pads for compact design, then device area is reduced, but solder bridges between adjacent electric patterns increase
Solution Approach 1:
The solder mask layer serves as a protective intermediary between closely spaced electrical traces and adjacent electric patterns. By positioning the mask layer at different heights and creating spacing between the first and second mask layers, it prevents solder material from bridging across to adjacent patterns while allowing the traces to remain close to pads for compact design.
Solution Approach 2:
The patent solves the two-dimensional layout problem by introducing a third dimension - varying the height of the solder mask layer. The first mask layer extends higher than the second mask layer, creating a stepped structure that provides lateral protection for electrical traces without increasing the planar footprint, thus maintaining compact design while preventing solder bridges.
3Object-generated harmful factors
If solder mask layer completely covers electrical traces, then solder bridge prevention is improved, but electrical signal transmission is blocked
Solution Approach 1:
The solder mask layer is segmented into two distinct parts: a first mask layer that covers electrical traces and dummy traces at a higher level, and a second mask layer spaced apart from the traces at a lower level. This segmentation allows the mask to provide solder bridge prevention where needed (covering traces) while maintaining electrical signal transmission capability (spacing from active signal paths).
Solution Approach 2:
Different regions of the solder mask layer have different properties - the first mask layer has higher coverage and height for maximum protection, while the second mask layer has reduced height and spacing to allow signal transmission. This local differentiation of mask layer properties optimizes both solder bridge prevention and electrical signal transmission in their respective regions.
Data Source
AI summary
An electric apparatus may include a plurality of electric patterns arranged on a substrate. Each of the electric patterns may include a pad for connection with a solder ball, an electrical trace laterally extending from a portion of the pad to allow an electrical signal to be transmitted from or to the pad, a first dummy trace laterally extending from other portion of the pad, and a first connection line connecting the first dummy trace to the electrical trace. The first dummy trace may be provided at a position deviated from a straight line connecting the pad to the electrical trace.