Solder Mask Positioning Using Carrier and Mask References
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Solution Overview
Problem
The increasing precision demands in electronic component manufacturing due to miniaturization require more accurate processing methods, but existing solutions are expensive and inefficient, particularly in maintaining accurate solder mask positioning for precise separation and attachment of components.
Innovation Solution
A method that detects carrier-related and solder mask-dependent references to accurately position the solder mask on the carrier, allowing for precise processing and separation of electronic components, utilizing these references across multiple production steps to enhance accuracy and reduce errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the accuracy of existing process equipment is increased to meet higher accuracy demands, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent introduces a vision system as an intermediary measurement tool that detects carrier-related references and solder mask references to determine their relative positions. This mediator enables accurate positioning without requiring the process equipment itself to have inherently high precision, thus resolving the contradiction between manufacturing precision and device complexity
Solution Approach 2:
The patent replaces mechanical positioning systems with an optical vision-based measurement system. Instead of relying on mechanically precise equipment to maintain positioning accuracy, the system uses optical detection of references and computational processing to achieve the required precision, reducing mechanical complexity
2Manufacturing precision
If the accuracy of existing process equipment is increased to meet higher accuracy demands, then manufacturing precision is improved, but cost increases
Solution Approach 1:
The vision system acts as a cost-effective intermediary that provides precise measurement capabilities without requiring expensive upgrades to the process equipment. The system uses software-based reference detection and coordinate transformation to achieve high accuracy at lower cost
Solution Approach 2:
The patent creates a digital copy of the physical references (carrier-related and solder mask) through vision detection. This digital representation is then processed through coordinate transformations to guide the separation process, eliminating the need for expensive physical measurement instruments
3Measurement precision
If carrier related references are used for positioning, then processing accuracy is improved, but the accuracy is independent of actual solder mask position which may cause errors in separation
Solution Approach 1:
The patent implements a feedback mechanism where the vision system detects both carrier-related references and solder mask references, determines their relative positions, and uses this information to correct positioning errors. The system calculates the difference between expected and actual solder mask positions and compensates for these deviations in the separation process
Solution Approach 2:
The patent introduces solder mask references as an intermediary element that links the carrier coordinate system to the solder mask coordinate system. This intermediary enables the system to detect and compensate for solder mask positioning deviations, ensuring accurate separation despite variations in solder mask application
Data Source
AI summary
The present invention relates to a method of processing a solder masked carrier with electronic components, comprising the detection of a carrier related reference and the detection of a solder mask dependent reference, which detected reference are used for processing the position of the solder mask on the carrier. The invention also relates to an electronic component as produced with such method.