Soldering Non-Conductive Components via Direct Electrode Contact
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Solution Overview
Problem
Existing methods for soldering non-metallically conductive components require electrical current to pass through the components, which is not feasible for electrically isolating components or those that can be damaged by current intensities, and often require additional heating elements or metallization, limiting their application and efficiency.
Innovation Solution
A method where a solder layer is applied to the connection surface of non-metallically conductive components, and an electric current of different polarity is passed through the solder layer via electrodes directly contacting it, allowing selective conduction of thermal energy without charging the components, enabling localized heating and melting of the solder for connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical current is passed through components to heat solder material, then soldering can be achieved, but current cannot pass through electrically isolating components or components damaged by current intensities
Solution Approach 1:
The patent introduces a separate heating resistor as an intermediary element to generate thermal energy for melting solder material. This heating resistor is electrically isolated from the components being joined, allowing current to flow through the resistor without passing through the components. The heating resistor acts as a mediator that transfers thermal energy to the solder material through conduction, enabling soldering of electrically isolating components without exposing them to damaging current intensities.
2Object-affected harmful factors
If a separate heating resistor is provided on the substrate, then current does not pass through components, but space is required for the heating resistor and metallization is costly
Solution Approach 1:
The patent makes the substrate multi-functional by requiring it to possess both mechanical support functions and thermal conduction functions. The substrate serves as the base structure for mounting components while simultaneously acting as the heating element that conducts thermal energy to the solder material. This eliminates the need for a separate dedicated heating resistor, reducing device complexity and removing the need for additional metallization layers specifically for heating purposes.
Solution Approach 2:
The patent combines the substrate and heating element into a single integrated structure. The substrate is designed to directly conduct thermal energy from the solder material application area to the joint region, merging the functions of structural support and thermal management. This integration eliminates the need for separate heating components and reduces overall device complexity while maintaining the ability to solder electrically isolating components.
3Manufacturing precision
If laser radiation is used to heat solder material, then localized heating is achieved, but laser light must be directed through optically transparent materials
Solution Approach 1:
The patent replaces the optical heating method (laser radiation requiring optical transparency) with a thermal conduction-based heating method. Instead of using laser light that must pass through the substrate, the system uses direct thermal conduction through the substrate and solder material. This substitution of heating mechanism eliminates the optical transparency requirement, enabling the soldering of components with opaque or non-transparent substrates while maintaining controlled and localized heating through direct thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for symmetrical heating of components without passing current through them, reducing process time, eliminating the need for separate heating measures, and enabling efficient, automated series production of solder connections, particularly in electro-optical systems, while avoiding oxidation and material limitations.
Implementation Method 1
the thermal energy generated due to the electrical resistance, the component and the soldering material are heated to such an extent that the soldering material melts
Implementation Method 2
The thermal energy is conducted through the substrate to the solder material, which is why the substrate must have sufficient thermal conductivity
Implementation Method 3
it is known to heat the solder material solely with laser radiation
Implementation Method 4
the soldering material melts and connects to the component
Data Source
Figure 1~2
Figure 3~6
AI summary
A method for producing a soldered connection between two components (1, 2, 11) and a device suited for carrying out the method are described. It is provided that a solder layer (5, 15 to 18) is applied onto at least one of the components (1, 2, 11) and that electric current that is fed by at least two electrodes (6a, 6b) is conducted through the solder layer (5, 15 to 18) in order to melt at least part of the solder, wherein the at least two electrodes (6a, 6b) come in direct contact with the solder layer (5, 15 to 18).