Solder Nozzle Cleaning by Pump Capacity Control and Flux Overflow
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Solution Overview
Problem
Solder nozzles in selective wave soldering systems undergo a 'deactivation process' due to high temperatures, soiling, erosion, and nitrogen atmosphere, leading to fluctuating soldering quality and potential failures in solder joints.
Innovation Solution
A method involving a variable pump capacity soldering system where a powdered cleaning agent, such as adipic acid, is introduced into the nozzle outlet, liquefied by contact with liquid solder, and then increased pump capacity is used to flow the cleaning agent over the nozzle's outer side, breaking down deposits and maintaining homogeneous wetting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the solder nozzle is used continuously for selective wave soldering, then productivity is maintained, but the solder nozzle undergoes deactivation and contamination leading to deteriorating soldering quality
Solution Approach 1:
The patent implements periodic cleaning cycles during continuous soldering operation. The solder pump capacity is periodically increased to generate higher solder flow that flushes cleaning agents through the nozzle, removing contaminants at regular intervals without stopping production. This periodic maintenance action restores nozzle performance while maintaining overall productivity.
Solution Approach 2:
The patent introduces cleaning agents into the solder stream before the nozzle becomes significantly contaminated. By proactively applying cleaning agents and periodically flushing them through the nozzle, the system prevents severe deactivation rather than reacting to quality deterioration, maintaining consistent soldering quality throughout operation.
2Reliability
If the pump capacity is increased to flush cleaning agent over the nozzle outer side, then cleaning effectiveness is improved, but the risk of solder splashing and safety hazards increases
Solution Approach 1:
The patent uses cleaning agents as intermediary substances that facilitate nozzle cleaning without requiring extreme solder flow increases. The cleaning agents chemically interact with contaminants on the nozzle surface, allowing effective cleaning at moderate pump capacities. This intermediary approach achieves cleaning goals while avoiding the harmful effects of high-velocity solder discharge.
Solution Approach 2:
The patent temporarily changes the pump capacity parameter to a higher level only during brief cleaning intervals, then returns to normal operating capacity. This transient parameter change enables sufficient cleaning action while limiting the duration and extent of safety risks. The system carefully controls the timing and magnitude of capacity increases to balance cleaning effectiveness with safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures consistently high soldering quality by removing impurities and maintaining uniform wetting of the solder nozzle, preventing deactivation and ensuring reliable solder joints.
Implementation Method 1
the cleaning agent is liquefied by contact with the liquid solder
Implementation Method 2
the cleaning agent is liquefied and boiled after being introduced into the nozzle outlet
Data Source
AI summary
The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder. The invention relates, in particular, to a method for cleaning a solder nozzle comprising the following steps: conveying solder from the solder reservoir at a first pump capacity which is adjusted in such a way that a standing wave of liquid solder is generated at a solder level which is below an upper edge of the nozzle outlet of the solder nozzle; introducing a cleaning agent into the nozzle outlet of the solder nozzle; increasing the pumping capacity of the solder pump to a second pump capacity such that the cleaning agent flows over the upper edge of the nozzle such that the cleaning agent is guided to an outer side of the solder nozzle.