Semiconductor Solder Pad Transfer Structure for Signal Integrity
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Solution Overview
Problem
The large size of solder balls and solder pads in semiconductor structures leads to a significant area occupation, squeezing signal transmission lines and causing them to be thin and prone to breakage, as well as resulting in signal integrity issues due to long winding paths.
Innovation Solution
A semiconductor structure design that includes a substrate with a first solder pad covered by a transferring part with a first and second subpart, where the orthographic projections of the first subpart and solder pad fall within the projection of the second subpart, allowing for a reduced size of the solder pad and a larger area for signal transmission lines, thereby reducing the risk of breakage and signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the size of solder pads and solder balls is increased to ensure reliable soldering, then the soldering reliability is improved, but the area occupied by signal transmission lines is reduced, making them thin and prone to breakage
Solution Approach 1:
The patent introduces a transferring part with multiple subparts (first subpart, second subpart, third subpart) that extend in the vertical dimension above the substrate surface. This allows the solder pad area on the substrate to be reduced while the solder ball is supported by the multi-level transferring structure, effectively moving the soldering function to a different spatial dimension and resolving the conflict between solder pad size and signal line area.
2Reliability
If the size of solder pads and solder balls is increased to ensure reliable soldering, then the soldering reliability is improved, but the signal transmission path becomes long and winding, causing signal integrity problems
Solution Approach 1:
The transferring part with its multi-subpart structure provides vertical support that allows signal transmission lines to maintain shorter, more direct paths on the substrate surface. The solder ball is elevated and supported by the transferring structure, decoupling the signal path length from the solder joint formation, thus improving signal integrity while maintaining reliable soldering.
3Strength
If the area occupied by solder pads and solder balls is reduced to increase signal transmission line area, then the signal transmission line width is increased, but the soldering reliability may be compromised
Solution Approach 1:
The patent uses the vertical dimension by creating a multi-level transferring part structure that rises above the substrate. This allows the solder ball to be supported at an elevated position by the first, second, and third subparts, enabling reduced solder pad area on the substrate while maintaining adequate support for reliable soldering through the vertical transferring structure.
Data Source
AI summary
A semiconductor structure includes: a substrate including a first surface; a first solder pad located on the first surface; a transferring part located on the first solder pad, in which the transferring part includes a first subpart covering the first solder pad and a second subpart covering the first subpart, and orthographic projections of the first subpart and the first solder pad on the first surface fall within an orthographic projection of the second subpart on the first surface; and a solder ball located on the second subpart.