Solder Paste Bead Recovery for Automated Stencil Changeover
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Solution Overview
Problem
Existing stencil printers require manual intervention for routine operations such as changeover and replacement of stencils, solder paste cartridges, and squeegee blades, leading to inefficiencies and downtime in PCB fabrication.
Innovation Solution
A stencil printer with an integrated solder paste bead recovery system that automates the process of removing and depositing solder paste beads from and onto stencils, using a paste pan and tooling members to move the paste pan between storage and the stencil, and a squeegee blade assembly to transfer the solder paste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual intervention is used for stencil changeover and replacement operations, then operators can perform tasks with flexibility, but production downtime increases and productivity decreases
Solution Approach 1:
The system enables automated self-service through the robotic arm that automatically performs stencil removal, paste pan placement, and stencil installation without human intervention. The robotic arm navigates the workspace, manipulates components, and completes the entire changeover sequence autonomously, eliminating the need for operators to manually perform these tasks while maintaining continuous production operation
Solution Approach 2:
The paste pan is positioned in a storage location within the printer workspace before the stencil changeover begins. The robotic arm retrieves the pre-positioned paste pan and places it on the stencil during the automated changeover process, preparing components in advance to enable seamless transition without production interruption
2Quantity of substance
If solder paste is left on the stencil after printing, then material remains available for potential reuse, but waste increases when the stencil is discarded
Solution Approach 1:
The system recovers solder paste from the stencil by using the robotic arm to carefully scrape and collect excess paste into a designated container during the automated changeover process. This recovery action prevents the paste from being discarded with the stencil, allowing it to be reused in future printing operations and reducing material waste
Solution Approach 2:
A paste recovery container serves as an intermediary component between the stencil and the disposal process. The robotic arm transfers the solder paste from the stencil surface to this intermediate container, which is positioned within the printer workspace, enabling paste recovery without interrupting the stencil changeover operation
3Productivity
If automated robotic systems are implemented for stencil changeover, then productivity increases and downtime reduces, but device complexity increases
Solution Approach 1:
The robotic arm is designed as a multi-functional device that performs multiple operations including navigating the workspace, gripping and manipulating stencils and paste pans, scraping solder paste, and placing components in correct positions. This universal tool replaces multiple specialized manual operations with a single automated system, increasing productivity while managing complexity through functional integration
Solution Approach 2:
The system merges the stencil changeover operation with the paste recovery operation into a single automated sequence performed by the robotic arm. Instead of separate manual processes for changing stencils and recovering paste, the robotic arm executes both tasks in an integrated workflow, reducing overall system complexity while maximizing productivity gains
Data Source
AI summary
A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.