Solder Paste Tub Height Compensation to Prevent Nozzle Dripping
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Solution Overview
Problem
Existing automatic solder paste addition apparatuses face challenges with solder paste dripping due to its own weight, leading to residual paste accumulation at the nozzle mouth and increased maintenance costs.
Innovation Solution
An apparatus that offsets the weight of the solder paste tub by using a working platform and holder system with a height adjustment mechanism, including flat spiral springs, to adjust the position of the solder paste nozzle and housing, preventing dripping and reducing residual paste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a tray is added to receive dripping residual solder paste, then solder paste dripping is managed, but personnel maintenance costs increase due to operator cleaning requirements
Solution Approach 1:
The system uses the weight of the solder paste tub itself to automatically counteract dripping through the height adjustment mechanism, eliminating the need for operator cleaning and external trays. The solder paste tub automatically adjusts its position to prevent residual paste accumulation.
2Ease of operation
If two independent drive components are used for positioning and solder addition, then precise control is achieved, but the control system and mechanical structure become complicated
Solution Approach 1:
The patent combines positioning and solder addition functions into a single drive component. The solder paste tub's weight provides automatic positioning, while a single drive mechanism controls the extrusion process, simplifying the overall system architecture while maintaining operational precision.
3Device complexity
If the solder paste tub is held in a fixed position, then structural simplicity is maintained, but solder paste drips due to its own weight
Solution Approach 1:
The system uses the weight of the solder paste tub as a counterbalancing force. By allowing the tub to move vertically under its own weight through the height adjustment mechanism, the system creates a self-regulating system where gravity prevents dripping without requiring complex active counterweight mechanisms.
Solution Approach 2:
The solder paste tub transitions from a fixed position to a dynamically adjustable position. The height adjustment mechanism allows the tub to move vertically, enabling the system to adapt to different solder paste volumes and maintain optimal positioning without dripping, while keeping the overall structure simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces solder paste dripping and maintenance costs by ensuring efficient paste distribution and utilization, simplifying the mechanical structure and control system of the apparatus.
Implementation Method 1
a height adjustment apparatus, with one end of the height adjustment apparatus being connected to the holder, and another end of the height adjustment apparatus being connected to the working platform support apparatus, for the purpose of adjusting the height of the holder relative to the working platform support apparatus
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
The present application provides an apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing.