Solder Paste Feeding Assembly to Prevent Nozzle Dripping
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Solution Overview
Problem
Existing automatic solder paste addition apparatuses for solder paste printers are complex, occupy large space, and incur high costs due to the need for multiple drive components and periodic operator maintenance for cleaning residual solder paste, which also leads to inefficiencies in solder paste utilization and production efficiency.
Innovation Solution
The use of a solder paste tub housing with a limiting flange and a holder that moves relative to the nozzle, combined with a height adjustment apparatus like a flat spiral spring, to prevent solder paste dripping and ensure efficient extrusion, simplifying the mechanical structure and control system while reducing waste and maintenance needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If two independent drive components are used for positioning and solder addition actions, then the solder paste can be distributed onto the stencil, but the control system and mechanical structure become complicated, occupying large space and increasing costs
Solution Approach 1:
The patent combines the positioning and solder addition actions into a single drive component. The solder paste tub assembly is designed with a tilt mechanism where one drive component simultaneously performs both positioning (moving the assembly to a given position above the stencil) and solder addition (extruding solder paste onto the stencil) functions, thereby simplifying the control system and mechanical structure while maintaining operational capability
2Device complexity
If the solder paste tub is held by the weight of solder paste, then the structure is simple, but residual solder paste drips from the nozzle mouth due to gravity and viscosity
Solution Approach 1:
The patent introduces a dynamic control mechanism where the drive component can precisely control the tilt angle and position of the solder paste tub assembly. By dynamically adjusting the position and applying controlled force, the system prevents residual solder paste from dripping due to gravity while maintaining the ability to extrude solder paste onto the stencil when needed
Solution Approach 2:
The patent applies preliminary anti-action by using the drive component to counteract the gravitational force on residual solder paste before dripping occurs. The controlled positioning and tilting mechanism creates a preliminary opposing force that prevents the harmful effect of solder paste dripping, thereby reducing material waste
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces solder paste dripping, increases utilization rates, saves costs, and enhances production efficiency by preventing unnecessary solder paste from reaching incorrect positions, thus streamlining the solder paste addition process in solder paste printers.
Implementation Method 1
a height adjustment apparatus like a flat spiral spring
Implementation Method 2
due to the solder paste's own weight
Implementation Method 3
pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste
Data Source
AI summary
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.