Solder Paste Storage Module With Independent Peltier Jar Temperature Control
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Solution Overview
Problem
Existing solder paste storage modules are limited by the need for uniform temperature storage within sectors, lack of individual temperature control per jar, and inability to heat jars to room temperature without removal.
Innovation Solution
A module with individual thermal groups using Peltier cells and fans to control the temperature of each jar independently, allowing random placement and simultaneous heating or cooling within the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If solder paste is stored in sectors with uniform temperature control, then temperature stability is maintained, but individual temperature control per jar is lost and storage flexibility is reduced
Solution Approach 1:
The storage module is divided into multiple independent thermal zones, each capable of maintaining a different temperature. Each zone contains one or more jars and is controlled by its own thermostat, allowing individual temperature control for each jar while maintaining overall system stability.
Solution Approach 2:
The system allows dynamic reconfiguration of temperature zones. Users can define custom temperature ranges for different zones and dynamically adjust which jars are placed in which zones based on their specific temperature requirements, providing adaptability while maintaining stability.
2Device complexity
If the module is divided into multiple independent sectors, then temperature control is simplified, but storage capacity is reduced and jars cannot be arranged randomly
Solution Approach 1:
Each thermal zone is designed to be universal in function, capable of storing multiple jars with different temperature requirements. The zones can be configured to accommodate various jar sizes and types, maximizing storage capacity while maintaining simplified temperature control through standardized zone management.
3Ease of manufacture
If jars are stored in fixed sectors, then temperature maintenance is easier, but heating jars to room temperature requires removal from the module
Solution Approach 1:
The system includes heating elements within each thermal zone that can pre-heat jars to the required room temperature before use. This preliminary heating action eliminates the need to remove jars from the module for heating, while temperature maintenance is simplified by the automated control systems that manage both cooling and heating functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables independent temperature control and heating of each jar, optimizing storage capacity and flexibility, and ensuring jars are ready for use without removal.
Implementation Method 1
each thermal group (7) comprises a Peltier cell (11) coupled to a heat sink (8) provided with a fan (12)
Implementation Method 2
a heat sink (8) provided with a fan (12)
Data Source
Figure 1
Figure 2
Figure 3~6
AI summary
The present disclosure relates to a module (1) for storing solder paste for soldering, the module (1) comprising a container (2) provided with an access door (3) and configured to accommodate a plurality of jars (4) containing solder paste, support planes (5) arranged inside the container (2) and ventilation means (6) of the internal volume delimited by the container (2). The module (1) further comprises a plurality of thermal groups (7) which are supported by the support planes (5) and each thermal group (7) is configured to accommodate a jar (4) to cool and/or to heat and/or to maintain the solder paste contained in the jar (4) at a pre chosen temperature. Each of the thermal groups (7) comprises a Peltier cell (11) associated with a heat sink (8).