Solder Paste Printing Prediction for Stencil Volume Control
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Solution Overview
Problem
The existing manufacturing processes for surface mounting substrates face defects due to inconsistent volume of solder paste application, which can be excessive or insufficient, during the stencil printing process, affecting the quality of the printed circuit boards.
Innovation Solution
A printing result prediction device utilizing a machine learning-based prediction model that predicts the volume of solder paste to be printed by inputting various printing conditions, including stencil, solder paste, substrate, and printer parameters, to enhance accuracy and consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional stencil printing process is used, then manufacturing process is simple, but printing precision of solder paste volume is poor
Solution Approach 1:
The system performs preliminary actions by acquiring printing condition information before actual printing, processing this information through machine learning models to predict solder paste volume, and determining appropriate printing parameters in advance. This preliminary prediction and parameter determination prevents printing defects before they occur, improving manufacturing precision without requiring complex real-time intervention during the printing process itself.
Solution Approach 2:
The system implements feedback by acquiring actual printing condition information from the stencil printing process, comparing it with standard values through machine learning models, and using the prediction results to determine optimized printing parameters. This closed-loop feedback mechanism continuously improves printing precision by learning from actual process data and adjusting parameters accordingly, while maintaining relatively simple device architecture.
2Productivity
If printing parameters are not optimized, then operation is simple, but productivity is reduced due to defects
Solution Approach 1:
The system implements self-service by automatically acquiring printing condition information, processing it through machine learning models to predict solder paste volume, and autonomously determining optimized printing parameters without requiring manual intervention. This automated self-service approach improves productivity by eliminating defect-related rework and delays, while the computational complexity is confined to software algorithms rather than physical device complexity.
3Manufacturing precision
If printing conditions are not controlled, then process is easy to operate, but manufacturing precision deteriorates
Solution Approach 1:
The system replaces manual mechanical control of printing parameters with an automated information processing system. Machine learning models process printing condition information and automatically determine optimized parameters, substituting the need for operator skill and manual adjustment. This improves manufacturing precision while maintaining ease of operation, as the automated system handles the complex control decisions without requiring sophisticated manual intervention.
Data Source
AI summary
A printing result prediction device is configured to predict a volume of solder paste printed by a printer onto a substrate. The printer is configured to print the solder paste by filling the solder paste into a stencil aperture of a stencil disposed on the substrate. The printing result prediction device includes a calculation part. The calculation part is configured to input a printing condition to a prediction model trained by machine learning, and predict a volume of solder paste printed by the stencil aperture of the stencil in a next printing using the input printing condition. The printing condition includes stencil information related to the stencil used to print, solder paste information related to the solder paste used to print, substrate information including unevenness information related to a protrusion on the substrate used to print, and a printing parameter of an operation of the printer when printing.