Solder Paste Reflow for Embedded Die Components
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently mounting semiconductor devices and other electronic components on circuit boards, particularly in creating reliable and compact connections using solder paste, which can be complex and require multiple steps.
Innovation Solution
A method involving applying solder paste to a circuit board, arranging electronic components with dielectric layers and semiconductor dies, and melting the solder to create connections between the components and the board, allowing for a single-step reflow process that simplifies the mounting process and enhances electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor packaging technologies are used to mount semiconductor devices and electronic components, then reliable connections can be achieved, but the mounting process becomes complex and requires multiple steps
Solution Approach 1:
The patent combines the mounting of semiconductor devices and electronic components into a single simultaneous reflow soldering process. Multiple components including semiconductor devices with contact pads and electronic components with contacts are arranged together on the circuit board and soldered in one step, eliminating the need for separate mounting operations while maintaining connection reliability
2Reliability
If multiple mounting steps are used to achieve reliable connections, then connection reliability is improved, but manufacturing time and process complexity increase
Solution Approach 1:
The patent applies solder paste to all contact pads and contacts in advance before the reflow process. This preliminary application of solder paste to multiple locations simultaneously enables all components to be mounted and soldered in a single reflow operation, improving manufacturing efficiency while ensuring reliable solder connections through proper paste placement
3Productivity
If a single-step reflow process is used to simplify mounting, then manufacturing efficiency is improved, but achieving reliable solder connections becomes more difficult
Solution Approach 1:
The patent applies solder paste selectively to specific contact pads and contacts based on their individual requirements. Each contact area receives appropriate solder paste application, ensuring optimal solder flow and connection quality for each specific joint while maintaining overall process efficiency in a single reflow step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and compact mounting of semiconductor devices and other components on circuit boards, reducing complexity and improving the reliability of solder connections, while allowing for a multiphase power supply arrangement.
Implementation Method 1
melting the solder paste to produce a molten solder that flows onto at least one of the first contact pad and the second contact pad
Data Source
AI summary
A method includes applying solder paste to a portion of a circuit board, arranging a first contact pad of a first electronic component adjacent the layer of solder paste, the first electronic component comprising a dielectric layer, at least one semiconductor die embedded in the dielectric layer, the at least one first contact pad being electrically coupled to the semiconductor die and arranged on a lower side of the dielectric layer, and at least one second contact pad positioned on an upper side of the dielectric layer, and melting the solder paste to produce a molten solder that flows onto at least one of the first contact pad and the second contact pad of the first electronic component.