Solder Paste Tube Sealing Assembly for Automated Tube Replacement
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Solution Overview
Problem
The existing solder paste tube replacement process in stencil printing systems is inefficient and lacks automation in securing and sealing the solder paste tube, requiring manual disassembly and assembly, which is time-consuming and not adaptable to different tube heights.
Innovation Solution
A solder paste tube assembly device with a top sealing device and bottom support device, controlled by an air cylinder and sensor system, allowing for automated ascent and descent to secure and seal solder paste tubes of varying heights, facilitating seamless replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual disassembly and assembly of solder paste tube is used, then the structure is simple, but the replacement efficiency is low and time-consuming
Solution Approach 1:
The assembly device is divided into independent functional modules: top sealing device with air cylinder, bottom support device with push rod, and sensor group. Each module operates independently but coordinates through control signals, enabling automated tube replacement while maintaining manageable system complexity
Solution Approach 2:
The top sealing device and bottom support device are designed to work together for both securing and sealing operations. The same mechanical structure serves multiple functions: the top sealing device seals the tube top, the bottom support device supports the nozzle, and together they enable automated replacement across different tube heights through coordinated movement
2Adaptability or versatility
If fixed height assembly is used, then the device structure is simple, but it cannot adapt to different tube heights
Solution Approach 1:
The top sealing device and bottom support device are designed with dynamic height adjustment capability through air cylinders. The devices can ascend and descend to different positions, allowing the system to adapt to solder paste tubes of varying heights while maintaining a relatively simple overall structure through standardized mechanical components
Solution Approach 2:
Manual height adjustment is replaced with automated pneumatic control. Air cylinders provide controlled movement of the top sealing device and bottom support device, eliminating the need for complex mechanical adjustment mechanisms while achieving precise height adaptation
3Extent of automation
If automated control system is added, then the replacement process is automated, but the control system complexity increases
Solution Approach 1:
Sensor groups are installed to detect the presence and position of solder paste tubes, providing feedback signals to the control system. This automatic feedback mechanism enables the control system to adjust the assembly process based on actual tube conditions, achieving high-level automation without requiring complex manual intervention or overly sophisticated control logic
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automated and efficient replacement of solder paste tubes, enhancing the automation level of printing machines by reducing manual intervention and adapting to different tube sizes, thus improving operational efficiency.
Implementation Method 1
the top sealing device comprises an air cylinder sliding block and a guide rod, wherein the guide rod extends in a height direction, the air cylinder sliding block is configured to ascend and descend in an extension direction of the guide rod
Implementation Method 2
the sealing assembly comprises an annular boss and a sealing ring, wherein the sealing ring is sleeved around the outer edge of the annular boss, and the annular boss is used for protruding into the top of the solder paste tube to be connected to the solder paste tube by means of the sealing ring in a sealing manner
Data Source
AI summary
The present disclosure provides a solder paste tube assembly device, a printing machine comprising same and a solder paste tube assembly method. The solder paste tube assembly device is used for securing and sealing a solder paste tube, in which a nozzle is arranged at the bottom of the solder paste tube, and the solder paste tube provides a solder paste by means of the nozzle, the solder paste tube assembly device comprises a support, a top sealing device and a bottom support device, the top sealing device is configured to controllably ascend and descend for connecting to the top of the solder paste tube at different heights in a sealing manner. The solder paste tube assembly device of the present disclosure can automatically complete the disassembly and replacement of the solder paste tubes and can automatically replace the solder paste tubes of different heights by means of the top sealing device capable of automatically ascending and descending.