On-Demand Solder Paste via Undercooled Core-Shell Particles
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Solution Overview
Problem
Conventional solder pastes face issues such as potential damage to electronic components during heating, limited shelf life due to chemical interactions, and logistical challenges like cold storage and transportation, which affect manufacturing yields and efficiency.
Innovation Solution
A system and method for producing solder paste using undercooled metallic core-shell particles, where the metallic core is surrounded by a shell and can be reconstituted from a solid to a liquid state, allowing for on-demand production and mixing with flux components to form a solder paste at lower temperatures, customizable for various applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solder paste is heated to the melting point of the metal solder, then the soldering process can proceed, but electronic components may be damaged and manufacturing yields decrease
Solution Approach 1:
The invention changes the physical state parameter of the solder metal from solid powder to liquid undercooled droplets. This fundamental parameter change allows the solder to be applied in a liquid state that flows and adheres to components, then solidifies upon cooling, eliminating the need for high-temperature re-melting during assembly and thereby protecting electronic components from thermal damage
Solution Approach 2:
The invention utilizes phase transition by maintaining the solder metal in a metastable liquid state through undercooling below its melting point. This phase transition approach allows the solder to remain liquid at application temperatures, providing flow and adhesion properties, while avoiding the harmful high-temperature phase change that would damage sensitive electronic components
2Ease of manufacture
If powdered metal solder is exposed to air or mixed with flux components, then the solder paste can be formulated, but chemical interactions reduce shelf life to typically 6 months
Solution Approach 1:
The invention performs preliminary action by pre-forming and stabilizing the solder metal in a controlled liquid undercooled state within a protective shell structure before exposure to air or flux components. This preliminary stabilization prevents premature chemical reactions and extends the usable shelf life of the solder paste formulation
Solution Approach 2:
The invention applies beforehand cushioning by enclosing the undercooled liquid solder metal within a protective shell that acts as a barrier against chemical interactions with air and flux components. This protective enclosure prevents degradation and extends shelf life before the solder paste is activated for use
3Duration of action of stationary object
If cold transportation and storage are implemented, then maximum shelf life of solder paste is achieved, but logistical complexity and costs increase
Solution Approach 1:
The invention changes the temperature parameter requirement from cold storage to ambient temperature stability by utilizing the metastable liquid state of undercooled solder metal. This parameter change eliminates the need for complex cold chain logistics while maintaining extended shelf life, as the solder remains stable in its undercooled state without requiring refrigeration
Solution Approach 2:
The invention extracts the requirement for cold storage and transportation from the solder paste system by using undercooled liquid metal droplets that remain stable at ambient temperatures. This extraction of the cold storage requirement simplifies logistics and reduces infrastructure complexity while maintaining product stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach extends the shelf life of solder paste components, eliminates the need for cold storage, allows for lower-temperature soldering, and enhances manufacturing efficiency and flexibility, enabling customized characteristics for different applications while reducing waste and improving functionality.
Implementation Method 1
heating the particles above a melting point of the solid core and cooling the particles to place the cores into an undercooled liquid state
Implementation Method 2
cooling the particles to place the cores into an undercooled liquid state
Data Source
AI summary
A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.