Solder Pattern Layout for Accurate Micro-LED Transfer Bonding
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Solution Overview
Problem
The transfer accuracy of light-emitting elements to a target position on a panel substrate is critical for preventing defects in display devices, as misalignment or over-transfer can lead to non-transfer issues, reducing product yield and increasing defects.
Innovation Solution
A display device design that enhances the contact area between a bonding layer and light-emitting elements by adjusting the size and thickness of solder patterns, ensuring accurate transfer and bonding of light-emitting elements to electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light-emitting element is transferred to the panel substrate, then the display device can be assembled, but transfer accuracy issues cause non-transfer defects and reduce product yield
Solution Approach 1:
The patent adjusts the size and thickness parameters of the solder pattern to optimize bonding performance. By changing these physical parameters, the solder pattern achieves better contact area with the light-emitting element, ensuring accurate transfer and bonding while reducing non-transfer defects.
Solution Approach 2:
The solder pattern is prepared in advance on the panel substrate with optimized dimensions and thickness before the light-emitting element transfer process. This preliminary preparation ensures that when transfer occurs, the bonding conditions are already optimal, improving transfer accuracy and reducing defects.
2Manufacturing precision
If the contact area between bonding layer and light-emitting element is increased, then transfer accuracy improves, but the bonding layer structure becomes more complex
Solution Approach 1:
The solder pattern is designed with non-uniform distribution, concentrating the bonding material specifically at the contact area between the light-emitting element and panel substrate. This local concentration of bonding quality ensures accurate transfer without requiring the entire bonding layer to be complex.
Solution Approach 2:
The patent addresses the contact area issue by adding the thickness dimension to the solder pattern design. Instead of only increasing area, the optimized thickness provides additional bonding interface, achieving improved transfer accuracy without excessive planar complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves transfer accuracy, reduces non-transfer percentage, enhances transfer speed, minimizes defects, and extends the lifespan of the display device while lowering power consumption.
Implementation Method 1
each of the plurality of light-emitting elements is bonded to and electrically connected to each first electrode by melting of the solder pattern
Data Source
AI summary
A display device and a display panel are discussed. The display device in some examples includes a substrate, a driving chip disposed on the substrate, a plurality of light-emitting elements disposed on the driving chip and electrically connected to the driving chip, a plurality of first electrodes respectively disposed under the plurality of light-emitting elements, and a plurality of solder patterns respectively disposed on upper surfaces of the plurality of first electrodes so as to respectively overlap the plurality of light-emitting elements. Each of the light-emitting elements is bonded to one of the first electrodes by melting of at least one of the solder patterns.