Solder Piece Orientation for Reliable Vacuum Suction
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Solution Overview
Problem
The surface of solder pieces with a shear droop portion formed during the punching process can become a sucked surface, leading to failure in vacuum suction and subsequent failure to supply the solder piece during mounting on a substrate.
Innovation Solution
Configuring the solder piece as a rectangular parallelepiped shape with specific surfaces designated as sucked surfaces, ensuring that the surface with the shear droop portion is not exposed during vacuum suction, and using a supply tape with concave portions designed to accommodate the solder piece with the appropriate orientation to prevent suction failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the solder piece is fabricated by punching process with shear droop portion formed on the surface, then the solder piece can be manufactured with desired shape, but the surface with shear droop portion cannot be maintained by vacuum suction
Solution Approach 1:
The patent applies preliminary action by designing the punching process to create a specific surface orientation where the shear droop portion is formed on a non-sucked surface. The solder piece is configured with six surfaces where at least one surface is designated as a sucked surface, and the punching process is controlled to ensure the shear droop portion does not form on this sucked surface. This preliminary design ensures that when vacuum suction is applied during mounting, the suction acts on a smooth surface without the interference of the shear droop portion, thereby maintaining reliable suction while still achieving the desired manufacturing process.
2Ease of operation
If any surface of the solder piece becomes a sucked surface, then vacuum suction can be applied for mounting, but the shear droop portion interferes with suction effectiveness
Solution Approach 1:
The patent applies local quality by creating different surface characteristics on different faces of the solder piece. Specifically, at least one surface is designed as a sucked surface with smooth quality suitable for vacuum suction, while other surfaces may have the shear droop portion formed on them. This local differentiation ensures that when the solder piece is mounted, the vacuum suction acts only on the smooth sucked surface without interference from the shear droop portion, thereby maintaining both ease of operation and suction effectiveness.
3Productivity
If the solder piece is received in opened concave portion of supply tape, then the solder piece can be supplied and mounted, but the shear droop portion may cause suction failure
Solution Approach 1:
The patent applies preliminary action by pre-configuring the solder piece orientation in the supply tape during the punching and receiving process. The solder piece is received in the opened concave portion of the supply tape with a specific orientation that ensures the sucked surface faces upward or toward the suction source. This preliminary orientation control, combined with the design that places the shear droop portion on non-sucked surfaces, ensures that when the solder piece is later suctioned for mounting, the suction acts on the smooth surface without interference, thereby maintaining both supply efficiency and suction reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for secure suction and prevents failure in supplying the solder piece, ensuring reliable mounting and improved mechanical strength of soldered electronic components.
Implementation Method 1
The solder piece is received in an opened concave portion formed in a long supply tape... When mounting the solder piece on the substrate, the solder piece received in the opened concave portion is sucked and maintained by a vacuum suction
Implementation Method 2
the solder piece received in the opened concave portion is sucked and maintained by a vacuum suction and is taken out of the supply tape after the cover tape has been removed
Data Source
Figure 1~2
Figure 3
Figure 4A~4B
AI summary
To provide a solder piece that prevents its surface on which the shear droop portion generated by the punching process is formed from becoming a sucked surface. The solder piece 1A is provided with four surfaces, namely, a first surface 11, a second surface 12, a third surface 13 and a fourth surface 14, which can be an sucked surface on the occasion of handling; a fifth surface 15 which is a surface on which a shear droop portion 15a generated by the punching process is formed and a sixth surface 16 that is opposite to the fifth surface 15. The solder piece 1A is punched out in a direction shown in an arrow A with the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14 being shared surfaces. This enables the four surfaces thereof excluding from surfaces thereof the fifth surface 15 on which the shear droop portion 15a is formed and the sixth surface 16 that is opposite to the fifth surface 15 to be formed with desired size and precision. It is configured so that any one of the first surface 11, the second surface 12, the third surface 13 and the fourth surface 14 becomes a sucked surface and the fifth surface 15 on which the shear droop portion 15a is formed is prevented from becoming the sucked surface.