U- and C-Shaped Solder Pin Layout for Visible Joint Inspection
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Solution Overview
Problem
Assembling electronic components in small form factors within portable devices poses challenges in providing sufficient space for solder quality inspection during Final Assembly, Test and Pack (FATP) processes, as solder joints may not be visible in the final assembly.
Innovation Solution
A design where pins on a bottom component align with recesses on a top component, with the pins' shape matching the recesses and being partially surrounded, allowing for solder joints to be formed on the top surface, making them accessible for inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are integrated into smaller form factors, then device size is reduced, but solder joint visibility for inspection deteriorates
Solution Approach 1:
The patent repositions the solder joint from a hidden lateral position to a visible top surface position. By forming the solder joint on the top surface of the first component where it protrudes, the inspection plane shifts from a side view to a top view, making the solder joint accessible for visual inspection without increasing device footprint.
Solution Approach 2:
The pin structure acts as an intermediary element that extends the connection point to a location where solder joints are visible. The pin protrudes from the first component and extends toward the second component, creating an intermediate inspection platform that allows solder joint visibility while maintaining compact device dimensions.
2Strength
If pins are completely surrounded by recesses, then mechanical connection is strengthened, but solder material flow control becomes difficult
Solution Approach 1:
The recess is designed with non-uniform dimensions: it has a first dimension (width) that is less than the pin diameter, providing mechanical support and strength, and a second dimension (depth) that is greater than the pin diameter, creating a cavity for solder material accumulation. This local variation in recess geometry simultaneously achieves strong mechanical connection and controlled solder flow.
Solution Approach 2:
The patent varies the dimensional parameters of the recess relative to the pin. By making the recess width smaller than the pin diameter and the recess depth larger than the pin diameter, the design creates different functional zones: the narrow width provides mechanical support while the greater depth allows solder material to pool and solidify properly, controlling the soldering process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easier and more effective solder quality inspection during FATP processes by ensuring the solder joints are visible and accessible on the top surface, enhancing the assembly process in compact electronic devices.
Implementation Method 1
a top portion of the pins may be bent or curved over a top surface of the top component to prevent solder material from flowing down through the recesses
Data Source
AI summary
Electronic assemblies and methods of joining components are described. The electronic assemblies may include a bottom component with one or more pins mounted over a top component with one or more recesses, where the pins of the bottom component align with the recesses of the top component. Further, the recesses and pins may be structured so that the shape of the pins matches the shape of the recesses, and that the recesses at least partially surround the pins.