Solder Post Height Greater Than Width for Connector Density
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Solution Overview
Problem
Existing electrical connectors face issues with short-circuiting due to closely arranged terminals and insufficient soldering caused by reduced solder ball size, leading to reduced hole distance, which affects the electrical connection between the connector and the chip module or circuit board.
Innovation Solution
The electrical connector design features solder posts with a height greater than their maximum width, formed by a first and second base, where the second base's height is greater than half the maximum width, ensuring sufficient soldering quality and increased hole density, and includes a clamping portion with anti-siphon structure and elastic sheet to prevent short-circuiting and missing solder phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance among accommodating holes is reduced to achieve densification, then the density of the electrical connector is improved, but short-circuiting is likely to occur due to closely arranged terminals
Solution Approach 1:
The patent transforms the solder ball into a solder post with extended height in the vertical dimension. By making the height greater than the maximum width and designing a two-base structure, the solder post occupies more vertical space, which prevents short-circuiting between closely arranged terminals while allowing reduced horizontal spacing between accommodating holes.
Solution Approach 2:
The patent changes the geometric parameters of the solder joint from a spherical shape to a cylindrical post shape with specific height-to-width ratio. The height is set greater than the maximum width, and the two-base structure with specific height relationships creates adequate electrical isolation, enabling denser hole arrangement without short-circuit risk.
2Productivity
If the size of the solder ball is reduced to allow greater hole distance reduction, then the density is improved, but missing solder phenomenon occurs due to insufficiency of solder
Solution Approach 1:
The solder post extends vertically with height greater than maximum width, providing sufficient solder volume in the vertical dimension. The two-base structure ensures adequate solder distribution, preventing missing solder phenomenon even when hole distances are reduced for higher density.
Solution Approach 2:
The solder post employs a composite structure with a first base and a second base connected together. This two-base design optimizes solder distribution and volume, ensuring sufficient soldering material is provided while maintaining compact horizontal dimensions for higher density.
3Manufacturing precision
If the height of the solder post is increased to ensure soldering quality, then the soldering quality is improved, but the device complexity increases
Solution Approach 1:
The solder post is segmented into a first base and a second base connected together. The clamping portion clamps the first base, while the second base extends outside the clamping portion. This segmentation provides sufficient height for soldering quality while organizing the structure in a systematic way that manages complexity.
Data Source
AI summary
An electrical connector includes: an insulating body, provided with multiple accommodating holes; multiple terminals, respectively accommodated in the accommodating holes, where each of the terminals is provided with a clamping portion; and multiple solder posts, each being clamped by the clamping portion of one of the terminals. A height of each solder post is greater than a maximum width of each solder post. Each solder post is formed by a first base and a second base connected with each other. The clamping portion clamps the first base. The second base is located outside the clamping portion. A height of the first base and a height of the second base are both greater than one half of the maximum width of each solder post. The height of the second base is greater than 0.15 mm.