Solder Print Quality Diagnosis Using Multi-Stream Reliability Analysis
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Solution Overview
Problem
Conventional solder paste printing quality inspection methods are arbitrary and lack targeted maintenance suggestions, leading to inefficiencies in identifying printing quality issues and tracing root causes due to reliance on simple thresholds and invalid data.
Innovation Solution
A system and method that integrates operating, equipment, raw material, and environment data into a time data stream and inspection data into a location data stream, using data projection and similarity calculations to generate accurate maintenance suggestions based on reliability values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If simple threshold determination method is used for solder paste printing quality inspection, then the inspection process is simple and fast, but it reports too many false detects and lacks accuracy in identifying real quality problems
Solution Approach 1:
The patent transforms the inspection approach from using simple static thresholds to using dynamic parameters including time-series data, location-based data, and multiple inspection results (solder paste inspection, component inspection, circuit inspection). This allows the system to adapt to varying conditions and reduce false detects while maintaining inspection efficiency.
Solution Approach 2:
The patent introduces an intermediary analysis system that processes data from multiple sources (solder paste inspection data, component inspection data, circuit inspection data, equipment data, process data) before making quality determinations. This intermediary layer filters out false detects and identifies real quality problems by analyzing correlations across different data dimensions.
2Ease of operation
If conventional inspection determination method is used, then the inspection process is straightforward, but the equipment data provided contains large amounts of invalid and distorted data that limits help in tracing root causes
Solution Approach 1:
The patent extracts only the valid and relevant data from the large volume of equipment data by introducing location-based filtering and time-series analysis. It separates meaningful information (correlated with actual quality defects) from invalid and distorted data, enabling effective root cause analysis while maintaining operational simplicity.
Solution Approach 2:
The patent performs preliminary data processing and validation before root cause analysis by organizing equipment data, process data, and inspection data into structured formats with proper timing and location associations. This preliminary organization filters out invalid data early, making subsequent root cause analysis more efficient and accurate.
3Loss of time
If simple threshold-based inspection is used, then the determination process is quick, but it lacks guiding information for on-site investigation and improvement
Solution Approach 1:
The patent implements a feedback mechanism that provides maintenance suggestions based on the analysis of inspection results and their correlation with equipment and process data. The system analyzes the relationships between solder paste inspection data, component inspection data, circuit inspection data, and maintenance data to generate actionable guidance for on-site investigation and improvement, all within an efficient time framework.
4Device complexity
If conventional inspection methods are used, then the inspection process is simple, but the quality of solder paste printing is not completely equal to the quality of actual circuit connectivity
Solution Approach 1:
The patent merges multiple inspection results (solder paste inspection, component inspection, circuit inspection) with equipment data and process data to create a comprehensive quality assessment. This multi-dimensional approach ensures that the printed solder paste quality is evaluated in conjunction with actual circuit connectivity quality, providing a more reliable overall quality determination while managing system complexity through integrated data processing.
Data Source
AI summary
A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.