Solder Printing Inspection Apparatus for Reflow Shift Compensation
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Solution Overview
Problem
Existing solder printing inspection technologies face inconsistencies between pre- and post-reflow process inspection results due to positional shifts of cream solder, leading to potential waste and increased production costs, as the self-alignment effect during reflow can alter the accuracy of initial inspections.
Innovation Solution
A solder printing inspection apparatus that includes an irradiation means, ideal solder position generation, image processing for actual solder positions, and adjustment of inspection standards based on positional shifts, ensuring consistent inspection criteria across both stages by outputting mounting position adjustments to the component mounting apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If inspection is performed before reflow process using fixed positional shift range, then inspection speed is maintained, but inspection precision deteriorates due to inconsistency between pre- and post-reflow inspection results
Solution Approach 1:
The patent performs preliminary actions by detecting solder position shifts before the reflow process and using this information to adjust component mounting positions in advance. The inspection apparatus detects the actual position of printed solder, calculates the shift from the ideal position, and communicates this shift information to the component mounting apparatus before reflow occurs, enabling proactive compensation rather than reactive correction.
Solution Approach 2:
The patent implements a feedback mechanism where inspection results from the solder printing inspection apparatus are used to adjust component mounting positions. The system detects the actual solder position, determines the positional shift, and feeds this information back to the component mounting apparatus to modify mounting positions accordingly, creating a closed-loop control system that ensures consistency between pre- and post-reflow inspection results.
2Manufacturing precision
If component mounting position is adjusted based on solder shift, then mounting precision is improved, but device complexity increases due to coordination between inspection and mounting apparatus
Solution Approach 1:
The patent applies universality by having the inspection apparatus serve multiple functions: it not only detects solder printing quality but also measures positional shifts and communicates this data to the component mounting apparatus. This multi-functional approach allows one system to support both inspection and positioning functions, reducing the need for separate dedicated systems and simplifying overall system architecture.
Solution Approach 2:
The patent uses an intermediary approach where the inspection apparatus acts as a mediator between the solder printing process and the component mounting process. It detects solder position shifts and translates this information into actionable mounting position adjustments, serving as a communication bridge that coordinates between different manufacturing stages without requiring complex direct integration between all system components.
3Productivity
If fixed inspection range is used for solder position, then inspection process is simplified, but productivity decreases due to rework of falsely failed boards
Solution Approach 1:
The patent applies dynamics by making the inspection standards adaptive rather than fixed. The inspection apparatus adjusts acceptance criteria based on the actual solder position detected during inspection. When solder shifts from its ideal position, the system dynamically modifies the acceptable position range for component mounting, allowing the inspection standards to flex and adapt to real-world variations in the manufacturing process.
Solution Approach 2:
The patent implements parameter changes by modifying inspection acceptance parameters based on detected solder position shifts. Instead of using a fixed positional tolerance range, the system adjusts the acceptable position parameters dynamically according to the actual solder placement, changing the inspection criteria to match the actual manufacturing conditions and reduce false failures.
Data Source
AI summary
A component mounting system includes a solder printing inspection apparatus and a component mounting apparatus. The solder printing inspection apparatus includes an ideal solder position generation unit, an ideal loading position generation unit, an image processing unit, and an ideal solder inspection standard generation unit. The ideal solder position generation unit generates ideal solder position information, and the ideal loading position generation unit generates ideal loading position information. The image processing unit generates actual solder position information and loading estimate position information. The ideal solder inspection standard generation unit generates ideal solder inspection position information. A calculation apparatus inspects a solder included in a solder group based on actual inspection standard information obtained by shifting of the ideal solder inspection standard information by just the actual position adjustment information, and the calculation apparatus outputs mounting position adjustment information to the component mounting apparatus.