Solder Printing Pressure Control via Mask Surface Detection
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Solution Overview
Problem
The existing printing techniques for solder on a substrate overlaid on a mask suffer from instability in solder deposition due to varying amounts of solder on the mask's front surface, leading to inconsistent solder amounts printed on the substrate.
Innovation Solution
A printing apparatus with a squeegee that adjusts its printing pressure based on detected solder accumulation on the mask's front surface, using a detection device to sense physical changes and adjust pressure accordingly to maintain consistent solder deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixed printing pressure is applied by the squeegee, then the printing mechanism is simple to operate, but the amount of solder printed becomes unstable depending on the solder amount on the mask
Solution Approach 1:
The patent implements a feedback control mechanism where a detection device measures the solder amount on the mask front surface, and the control device adjusts the printing pressure based on this detection. The squeegee printing pressure is dynamically modified according to the detected solder accumulation, creating a closed-loop system that stabilizes the printed solder amount despite variations in initial solder deposition
Solution Approach 2:
The patent transitions from a static fixed printing pressure system to a dynamic adjustable pressure system. The printing pressure is no longer constant but is dynamically modified based on real-time detection of solder amount, allowing the system to adapt to varying solder accumulation conditions and maintain consistent printing quality
2Quantity of substance
If there is a large amount of solder on the mask front surface, then the solder filling force increases, but the squeegee cannot sufficiently scrape off the solder leading to over-printing
Solution Approach 1:
When a large amount of solder is detected on the mask front surface, the feedback control mechanism increases the squeegee printing pressure accordingly. This enhanced pressure enables the squeegee to effectively scrape off the excessive solder, preventing it from being printed on the substrate and thus avoiding over-printing while maintaining precise solder deposition control
3Quantity of substance
If there is a small amount of solder on the mask front surface, then the solder filling force decreases, but the squeegee may scoop out the filled solder leading to under-printing
Solution Approach 1:
When a small amount of solder is detected on the mask front surface, the feedback control mechanism reduces the squeegee printing pressure. This reduced pressure prevents the squeegee from scooping out the limited solder that has been filled into the pattern holes, ensuring that the small amount of solder is properly printed on the substrate without loss and achieving precise solder deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the amount of solder printed on the substrate regardless of the solder amount on the mask's front surface, preventing over- or under-deposition and ensuring consistent printing quality.
Implementation Method 1
a detection device executing detection operation for detecting a physical quantity that changes in accordance with an amount of solder of the solder accumulation on the front surface of the mask by sensing the front surface of the mask
Data Source
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AI summary
A printing apparatus includes: a mask formed with a pattern hole for printing; a printing mechanism having a squeegee that comes into contact with a front surface of the mask at a predetermined contact angle, the printing mechanism causing the squeegee to slide on the front surface of the mask with a predetermined printing pressure to move a solder on the front surface of the mask while scraping the solder by the squeegee, thereby printing the solder to a substrate via the pattern hole; a detection device executing detection operation for detecting a physical quantity that changes in accordance with an amount of solder on the front surface of the mask; and a control device adjusting at least one of the contact angle and the printing pressure of the squeegee on the basis of the physical quantity detected by the detection device.