Solder Resist Pigment Composition for Immersion Cooling Stability

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Solution Overview

Problem

Solder resists containing metallic phthalocyanine pigments are not chemically compatible with hydrocarbon immersion cooling fluids, leading to discoloration and accelerated degradation of the solder resist and contamination of the cooling fluid, which disrupts the reliability of image analysis and increases downtime due to fluid replacement.

Innovation Solution

Use of non-metallic phthalocyanine pigments, such as H2Pc, indanthrene, and ultramarine, in solder resists that are chemically compatible with hydrocarbon cooling fluids, preventing discoloration and degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If metallic phthalocyanine pigments are used in solder resists, then color strength and coverage are improved, but chemical compatibility with hydrocarbon cooling fluids deteriorates leading to discoloration and degradation

Engineering Contradiction:
Improvecolor strengthVSAvoidchemical compatibility
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent changes the chemical composition parameter of the pigment by removing the metal center from the phthalocyanine structure. This transforms the pigment from metallic phthalocyanine (which reacts with hydrocarbon cooling fluids) to non-metallic phthalocyanine (which is chemically compatible), thereby resolving the contradiction between color strength and chemical compatibility.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the durable but reactive metallic phthalocyanine pigment with a non-metallic alternative that, while providing similar color strength, offers long-term stability in immersion cooling environments. This substitution eliminates the need for frequent solder resist replacement due to chemical degradation.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Illumination intensity

If metallic phthalocyanine pigments are used in solder resists, then color strength is improved, but solder resist stability in immersion cooling environments deteriorates

Engineering Contradiction:
Improvecolor strengthVSAvoidsolder resist stability
Core Design Contradiction:
Illumination intensityVSStability of the object's composition

Solution Approach 1:

The patent modifies the chemical structure parameter of the pigment by eliminating the metal center, transforming metallic phthalocyanine into non-metallic phthalocyanine. This structural change maintains the pigment's color strength while dramatically improving its stability in hydrocarbon immersion cooling environments by eliminating the reactive metal center.

Inventive Principle:
Principle #35Parameter changes

3Illumination intensity

If metallic phthalocyanine pigments are used in solder resists, then color strength is improved, but cooling fluid purity deteriorates due to pigment leaching

Engineering Contradiction:
Improvecolor strengthVSAvoidcooling fluid contamination
Core Design Contradiction:
Illumination intensityVSLoss of substance

Solution Approach 1:

The patent converts the harmful reactive metal center of metallic phthalocyanine into a beneficial non-metallic structure. By removing the metal center, the pigment retains its color strength while eliminating its ability to leach into and contaminate the hydrocarbon cooling fluid, thus protecting fluid purity.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The non-metallic phthalocyanine pigment acts as an intermediary between the solder resist and the hydrocarbon cooling fluid. It provides the necessary color coverage for the solder resist while being chemically inert in the hydrocarbon environment, preventing direct harmful interactions between the metal-containing pigment and the cooling fluid.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250266345A1Methods and apparatus to reduce discoloration of solder resists in immersion cooling environments
Publication Date: 2025.08.21 INTEL CORP
  • US20250266345A1 patent drawing
  • US20250266345A1 patent drawing
  • US20250266345A1 patent drawing

AI summary

Systems, apparatus, articles of manufacture, and methods to reduce discoloration of solder resists in immersion cooling environments are disclosed. An example apparatus includes a substrate. The example apparatus further includes a solder resist layer on an exterior surface of the substrate. The solder resist layer does not include a transition metal.