Liquid Solder Resist Matte Surface via Resin Extraction
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Solution Overview
Problem
Conventional liquid solder resist compositions require large amounts of deglossing materials to achieve a matte surface, which compromises electric corrosion resistance, pressure cooker test resistance, and applicability due to increased thixotropic properties.
Innovation Solution
A liquid solder resist composition containing a carboxyl group-containing resin, a thermosetting component with a powdery epoxy compound, a photopolymerizable component, and a black coloring agent, which forms a solder resist layer with a matte surface through photocurability and alkaline developability, reducing the need for deglossing materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a large amount of deglossing material is added to achieve a matte surface, then the surface finish is improved, but electric corrosion resistance decreases
Solution Approach 1:
The invention extracts the deglossing material from the composition entirely, achieving a matte surface through the inherent properties of the resin components (carboxyl group-containing resin and powdery epoxy compound) without requiring silica, talc, or kaolin additives that compromise electric corrosion resistance
Solution Approach 2:
The invention creates local quality differences within the composition by using powdery epoxy compound particles that provide matte surface finish specifically at the surface level, while the bulk composition maintains excellent electric corrosion resistance through the resin matrix
2Shape
If a large amount of deglossing material is added to achieve a matte surface, then the surface finish is improved, but pressure cooker test resistance decreases
Solution Approach 1:
The invention removes deglossing materials from the composition, achieving matte surface finish through the resin components themselves, thereby eliminating the degradation of pressure cooker test resistance that occurs with high concentrations of particulate additives
3Shape
If a large amount of deglossing material is added to achieve a matte surface, then the surface finish is improved, but applicability decreases due to increased thixotropic property
Solution Approach 1:
The invention extracts deglossing materials from the composition and replaces them with resin components that provide matte finish without inducing thixotropic behavior, maintaining good applicability and ease of operation
Solution Approach 2:
The invention changes the fundamental mechanism for achieving matte surface from particulate addition to resin composition control, specifically utilizing the interaction between carboxyl group-containing resin and powdery epoxy compound to create surface roughness without affecting flow properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a matte surface without compromising electric corrosion resistance, pressure cooker test resistance, and applicability, while maintaining good heat resistance and flexibility, allowing for brighter light emission from light-emitting diodes on printed wiring boards.
Implementation Method 1
a liquid solder resist composition which has photocurability
Implementation Method 2
a carboxyl group-containing resin (A), a thermosetting component (B)
Data Source
AI summary
The present invention aims to provide a liquid solder resist composition in which a solder resist layer formed with the liquid solder resist composition can have a matte surface due to resin components in the composition. A liquid solder resist composition according to the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1). An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight%