Solder-Retaining Fastening Element for Repeatable Quick Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional fastening methods, such as screws, fail to firmly fix objects in place after assembly, making it difficult to repeatedly couple and separate objects quickly.
Innovation Solution
A structure and method for retaining fastening element solder, featuring a fastening element with a solderable surface and a retaining portion that solidifies solder during the soldering process, allowing for precise positioning and secure coupling and separation of objects through a fastening or hole portion, enabling repeated assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fastening methods (screws) are used to couple objects, then the objects can be coupled together, but the objects are not firmly fixed in place and cannot be repeatedly coupled and separated quickly
Solution Approach 1:
The invention divides the fastening element into distinct functional portions: a solderable surface for permanent attachment to the first object, a retaining portion for securing solder, and a fastening portion for removable coupling with the second object. This segmentation allows each portion to perform its specific function optimally, achieving both firm fixation and assembly efficiency.
Solution Approach 2:
The invention combines multiple fastening mechanisms into a single integrated fastening element: soldering provides permanent attachment to the first object, while the fastening portion enables removable coupling with the second object. This merging allows the system to achieve both firm fixation through solder and quick assembly/disassembly through the fastening portion.
2Reliability
If solder is used to firmly attach the fastening element to the first object, then firm coupling is achieved, but the solder may flow into the fastening portion and solidify, causing interference with the second object
Solution Approach 1:
The invention extracts the harmful effect by providing a dedicated retaining portion that captures and contains the solder, preventing it from flowing into the fastening portion. The retaining portion acts as a separate compartment that isolates the solder from the fastening functionality, eliminating the interference problem.
Solution Approach 2:
The retaining portion serves as an intermediary structure between the solderable surface and the fastening portion. It mediates the solder flow by providing a designated path and containment area, preventing the solder from directly entering the fastening portion and causing interference with the second object.
3Productivity
If the fastening element allows repeated coupling and separation, then assembly efficiency is improved, but the firm fixation is compromised
Solution Approach 1:
The fastening element is segmented into a solderable surface for permanent firm fixation to the first object and a fastening portion for removable coupling with the second object. This segmentation allows the system to simultaneously achieve firm fixation through solder and repeated assembly/disassembly through the fastening portion without compromising either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a secure and repeatable way to couple and separate objects by using a solderable surface and retaining portion, ensuring the fastening element is firmly attached to one object while allowing easy attachment and detachment of another object, enhancing assembly efficiency.
Implementation Method 1
an end of the hole portion or the fastening portion has a retaining portion which solder flows into or enters during a soldering heating process to cool down and solidifies
Implementation Method 2
solder flows into or enters during a soldering heating process to cool down and solidifies
Data Source
AI summary
A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.