Solder-Retaining Fastening Structure for Firm Fixing and Quick Release

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional fastening methods, such as screws, fail to provide a secure and repeatable coupling and separation mechanism between objects, leading to objects not being firmly fixed in place after assembly.

Innovation Solution

A structure and method for retaining fastening element solder, featuring a fastening element with a solderable surface and a retaining portion that solidifies within a fastening or hole portion during a soldering process, allowing for precise positioning and secure coupling and separation of objects using a variety of fastening and hole configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional fastening methods such as screws are used to couple objects, then the objects can be coupled together in an inseparable way, but the objects are not firmly fixed in place after assembly and cannot be quickly separated

Engineering Contradiction:
Improvefirm fixationVSAvoidquick separation
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The fastening element is divided into distinct functional portions: a solderable surface for permanent attachment to the first object, a fastening portion for reversible coupling with the second object, and a retaining portion to control solder flow. This segmentation allows each portion to optimize its specific function, achieving both firm fixation and quick separation capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention utilizes phase change of solder from liquid to solid state during cooling to achieve firm fixation. The solder transitions from a fluid state during application to a solid state after cooling, creating a permanent bond between the fastening element and the first object while maintaining the fastening portion's ability to be quickly coupled and decoupled

Inventive Principle:
Principle #35Parameter changes

2Reliability

If solder is applied during the soldering process, then the fastening element can be firmly coupled to the first object, but the liquid solder may flow into the fastening portion and solidify, causing interference with the second object

Engineering Contradiction:
Improvesolder joint strengthVSAvoidsolder interference
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The retaining portion extracts or contains the liquid solder away from the fastening portion during the soldering process. By providing a dedicated space (retaining portion) that captures the flowing solder, the invention prevents solder from entering the fastening portion and causing interference with the second object

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The retaining portion acts as an intermediary between the solderable surface and the fastening portion. It receives and contains the liquid solder during the soldering process, mediating the solder flow to prevent it from reaching the fastening portion where it would cause harmful interference

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables objects to be firmly coupled and quickly separated by utilizing the coordination between solderable surfaces and retaining portions, preventing interference and solidified solder from falling off, thus providing a versatile and reliable fastening solution.

Implementation Method 1

solder flows into the retaining portion to cool down and solidifies

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

the liquid solder resulting from heating is prevented from flowing into the hole portion or the fastening portion to cool down and solidify

Methodology Applied
Scientific EffectSolidification: Freezing

Data Source

PatentUS11638963B2Structure for retaining fastening element solder
Publication Date: 2023.05.02 DTECH PRECISION INDS
  • US11638963B2 patent drawing
  • US11638963B2 patent drawing
  • US11638963B2 patent drawing

AI summary

A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.