Solder-Coated Rivet Connector for Peel-Resistant Flat Conductors
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Solution Overview
Problem
Flat electrical conductors face challenges when connecting to conductive pads, such as peeling and heat-induced mechanical stress leading to glass fractures due to poor bonding and heat dissipation.
Innovation Solution
An electrical connector featuring a rivet with a solder-coated body and tubular shaft, where the tubular shaft is flared to increase diameter and has slits forming sharp corners, providing a strong mechanical and electrical attachment to flat conductors, and a dielectric housing encases the flared end to distribute heat and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flat electrical conductors are soldered to conductive pads, then electrical connection is achieved, but the bond is weak and subject to peeling
Solution Approach 1:
The electrical connector uses a composite structure combining a copper-based alloy body with a solder composition layer. The copper-based alloy provides mechanical strength and structural integrity, while the solder composition layer (e.g., lead-free solder alloy) provides strong bonding to the conductive pad. This composite material approach resolves the contradiction by integrating materials with complementary properties to achieve both electrical connection and resistance to peeling.
2Reliability
If heat is applied during soldering of thin flat conductors, then soldering is achieved, but high mechanical stress levels cause glass fractures
Solution Approach 1:
The patent modifies the thermal parameters of the soldering process by using a rivet structure with increased thermal mass compared to thin flat conductors. The rivet's geometry (body with tubular shaft) provides greater volume and surface area for heat dissipation, allowing the soldering process to be completed with reduced peak temperatures and slower heating rates. This parameter change reduces thermal stress on the glass substrate while maintaining reliable solder joints.
3Volume of moving object
If thin flat conductors are used, then packaging advantages are achieved, but heat dissipation is poor leading to high mechanical stress
Solution Approach 1:
The patent transitions from a two-dimensional thin flat conductor to a three-dimensional rivet structure with a body and tubular shaft. This dimensional change increases the volume and surface area available for heat dissipation while maintaining the space-efficient characteristics needed for packaging. The rivet's geometry provides thermal pathways in multiple directions, improving heat dissipation capability compared to thin flat conductors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a strong bond between the conductor and conductive pad, reduces the likelihood of peeling, and minimizes glass cracking by distributing heat, ensuring reliable electrical and mechanical connections.
Implementation Method 1
the first side of the body is placed on the conductive pad and the electrical conductor is heated until the solder reflows
Implementation Method 2
the electrical conductor is heated until the solder reflows
Data Source
Figure 1~2
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Figure 5~6
AI summary
An electrical device includes a flat electrical conductor (202) defining an aperture (204) and an electrically conductive rivet (100, 400) with a body (102, 402) having a layer of a solder composition (110, 410) disposed on a first side (104, 404) and a tubular shaft (106, 406) extending from a second side (108, 408) of the body (102, 402) opposite the first side (104, 404). A free end (112, 412) of the tubular shaft (106, 406) is flared such that the free end (112, 412) has a diameter larger than a diameter of the aperture (202).