Solder Supply Apparatus Pneumatic Control Differential Head
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Solder supply devices that move a solder container and piston by supplying air face issues with differential head, leading to time lags and reduced solder supply due to increasing air chamber volume, requiring complex control mechanisms to manage the movement and volume changes.
Innovation Solution
A solder supply device with a tubular solder container, a nozzle, a fixed piston, a moving device, and sensors that control the movement based on relative distance, adjusting air supply force according to the volume of the air chamber to maintain consistent solder supply, including a first control section for movement at a specified force and a second control section for increased force when the volume exceeds a set distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air is supplied to move the solder container or piston, then the solder supply device can operate without complex mechanical actuators, but the volume of the air chamber increases causing time lag and reduced solder supply accuracy due to differential head
Solution Approach 1:
The control device performs preliminary action by detecting the volume of the air chamber before supplying air, and based on this detection, determines and applies an appropriate air supply amount in advance. This prevents the time lag caused by differential head from affecting solder supply accuracy, as the control is adjusted before the air supply action occurs.
Solution Approach 2:
The control device incorporates feedback by detecting the air chamber volume and using this information to adjust the air supply amount. This closed-loop control ensures that the solder supply accuracy is maintained despite changes in air chamber volume, resolving the contradiction between simplified mechanical structure and precision control.
2Length of moving object
If the air chamber volume increases to accommodate movement of solder container or piston, then the device can handle larger movement ranges, but a time lag occurs leading to smaller amount of solder being supplied
Solution Approach 1:
The control device applies dynamics by making the air supply amount variable rather than fixed. It dynamically adjusts the air supply amount based on the detected air chamber volume, ensuring that even with larger movement ranges and increased air chamber volume, the solder supply amount remains appropriate and the time lag is compensated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively controls solder supply by adjusting air chamber volume influence, ensuring consistent solder delivery even when the air chamber volume increases, thus addressing the differential head issue and handling various solder types.
Implementation Method 1
the moving device moves the solder container by supplying air
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A solder supply device provided with solder cup 70 housing liquid solder that is cylindrical and open at one end, and supply nozzle 74 that is inserted into the solder cup, that supplies solder from inside the solder cup by moving the solder cup by supplying air to space 86, wherein a fixed amount of air is supplied in a case in which the solder cup movement distance is less than a specified distance, and a greater amount of air than the above specified amount is supplied in a case in which the solder cup movement distance is the set movement distance or greater. That is, when supplying solder, in a case in which the volume of the space to which air is supplied is a specified volume or greater, a greater amount of air is supplied than the air supply amount for when the volume of the space is a specified volume or less. Thus, even in a case in which the volume of the space is equal to or greater than the specified volume, it is possible to supply the same amount of solder as the solder supply volume in a case in which the volume of the space is less than the specified volume, thus it is possible to control operation of the solder supply device considering differential head.