Solder Joint Thickness Control Using Stop Plates and Pressure
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Solution Overview
Problem
Existing soldering methods face challenges in achieving quick, cost-effective, and high-dimensional accuracy connections between components, often resulting in incorrect positioning and voids due to complex multi-stage processes and lack of precise alignment and temperature control.
Innovation Solution
A soldering device with a stop device that adjusts the distance between a base plate and pressure plate to maintain a predetermined thickness, ensuring components are prestressed and aligned, and incorporating temperature control from above to prevent warping and voids, using a multi-chamber system for preheating, bonding, and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a multi-stage soldering process is used to achieve precise positioning and bonding, then the soldering quality is improved, but the process time and energy consumption increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-positioning components on a carrier board with precise locating features before the soldering process. The carrier board includes定位 structures that ensure accurate component placement in advance, eliminating the need for complex multi-stage positioning during soldering. This preliminary positioning maintains high precision while reducing overall process time.
Solution Approach 2:
The patent merges multiple functions into a single integrated soldering device that combines heating, pressing, and positioning capabilities. The device applies pressure and heat simultaneously while maintaining precise component positioning through the carrier board structure, consolidating what would traditionally require multiple separate operations into one efficient process step.
2Manufacturing precision
If adhesive material is used for temporary alignment and fastening before soldering, then component positioning is improved, but the process complexity and number of steps increase
Solution Approach 1:
The patent extracts the positioning function from the adhesive material and transfers it to the carrier board's mechanical locating structures. The carrier board includes precise guides and定位 features that hold components in the correct position without requiring adhesive. This removes the adhesive step from the process while maintaining alignment accuracy.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical positioning system. The carrier board uses precise mechanical structures such as guides, slots, and定位 features to maintain component alignment throughout the soldering process, eliminating the need for adhesive materials and simplifying the process.
3Strength
If pressure is applied during soldering to ensure good contact, then the bonding quality is improved, but component misalignment and void formation increase due to lack of distance control
Solution Approach 1:
The patent applies parameter changes by implementing a controlled pressure application sequence. The device first applies gentle pressure to establish contact between components and carrier board, then increases pressure to the optimal bonding level. This controlled parameter change ensures good bonding quality while preventing component misalignment and void formation that would result from excessive or uncontrolled pressure.
Solution Approach 2:
The patent applies preliminary action by pre-establishing the correct distance and positioning of components on the carrier board before applying bonding pressure. The carrier board's locating structures ensure components are at the correct height and position, so when pressure is applied, it maintains dimensional accuracy while achieving strong bonding.
4Productivity
If heating is applied to melt solder material, then the soldering process is achieved, but thermal warping and void formation occur due to uncontrolled temperature distribution
Solution Approach 1:
The patent applies local quality by implementing selective and controlled heating zones. The heating device applies heat locally to the solder joints that require bonding, rather than uniformly heating the entire assembly. This localized heating approach maintains dimensional stability of components while efficiently melting solder material in the specific areas needed, preventing thermal warping.
Solution Approach 2:
The patent applies continuity of useful action by maintaining optimal temperature and pressure throughout the soldering process. The device continuously applies controlled heat and pressure simultaneously, ensuring uniform temperature distribution and preventing void formation. This continuous controlled action maintains dimensional stability while achieving complete solder bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables faster, more accurate soldering with reduced material waste and improved dimensional precision by ensuring components are correctly aligned and thermally managed, minimizing the formation of voids and defects in the solder joint.
Implementation Method 1
heating and melting solder material which is arranged between the components to be connected
Implementation Method 2
cool it down in a controlled manner below the solidification point of the solder
Implementation Method 3
exert a pressing force on the soldering group
Data Source
Figure 1~2
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Figure 5
AI summary
The invention relates to a soldering device (50) for producing a solder connection between a plurality of components (12A, 12B) by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B), and/or for coating a component with solder material (16). Said soldering device comprises a base plate (66) and a pressure plate (64) between which a solder group (10) comprising the one or more components (12A, 12B) and the solder material (16) is received, said plates being adjustable relative each other in terms of their distance in order to exert a pressing force on the solder group (10). The soldering device is provided with a stop device (68) which limits the distance between the base plate (66) and the pressure plate (64) to a minimum distance so that the solder group (10) has a predetermined thickness once the solder material (16) has melted. The invention also relates to a joining method whereby prior to application of a pressure force the components to be joined (12A, 12B) are temporarily joined by a solid or pasty adhesive material to form a solder group (10) in which the components (12A, 12B) are held in place relative to each other in a joining position.