Electronic Package Solder Tips Preheating Crack Prevention
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Solution Overview
Problem
Conventional flip chip bonding methods face issues with solder cracks due to insufficient solder and solder collapse, leading to unbalanced stress and increased risk of cracks in metal bumps and solder balls during the manufacturing process.
Innovation Solution
A method for manufacturing electronic packages where solder tips are directly bonded to a carrier structure without a reflow process, with pre-heating and cooling processes applied to the carrier structure, and the electronic component to ensure sufficient solder distribution and bonding, eliminating the need for reflow and reducing stress on conductive bumps and solder tips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the amount of solder is increased, then solder collapse occurs during reflow, but if the amount of solder is decreased, then cracks appear in the solder balls during cooling
Solution Approach 1:
The patent applies pre-heating to the carrier structure before bonding to induce warpage in advance. This preliminary thermal action allows the carrier structure to expand and create space accommodation, preventing solder cracks during subsequent cooling without requiring excessive solder material. The pre-heating step prepares the system to handle the thermal cycling stresses that would otherwise cause cracking.
Solution Approach 2:
The patent changes the thermal parameters by pre-heating the carrier structure to a specific temperature range before bonding. This parameter change induces controlled warpage that compensates for subsequent cooling contraction, allowing sufficient solder material to be used without causing collapse, while ensuring cracks do not form during cooling.
2Manufacturing precision
If a reflow process is applied, then solder balls are formed, but unbalanced stress causes cracks in metal bumps and solder balls
Solution Approach 1:
The patent eliminates the conventional reflow process and instead applies pre-heating to the carrier structure before bonding. This preliminary thermal action on the carrier structure induces warpage that compensates for thermal contraction during cooling, creating balanced stress distribution without the harsh reflow cycle that causes unbalanced stress and cracking in metal bumps and solder balls.
Solution Approach 2:
The patent extracts and removes the reflow process from the manufacturing sequence. By eliminating this harmful process step, the patent avoids the unbalanced thermal stress that causes cracks in metal bumps and solder balls, while still achieving proper solder bonding through the alternative pre-heating and direct bonding approach.
3Reliability
If the carrier structure is pre-heated to induce warpage, then solder cracks are prevented, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the pre-heating step with the existing manufacturing process flow, integrating it as a preparatory step before bonding. By combining the thermal preparation with the carrier structure itself rather than requiring separate heating fixtures or complex equipment, the patent achieves crack prevention while minimizing added process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents cracks in conductive bumps and solder tips by ensuring a sufficient solder amount and improved bonding during thermal cycling, enhancing the reliability of the electronic package manufacturing process.
Implementation Method 1
pre-heating the carrier structure to allow the carrier structure to become warped
Implementation Method 2
heating the electronic component to allow the solder tips to become melted
Implementation Method 3
performing a cooling process
Data Source
AI summary
The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.