Semiconductor Solder Transfer Jig for Preform Position Stability

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Solution Overview

Problem

The preform solder separation phenomenon during semiconductor manufacturing leads to soldering defects, making it difficult to visually ascertain the separation and resulting in defects such as components being bonded to incorrect positions or not attached properly.

Innovation Solution

A transfer apparatus with a carrier, substrate, and guide jig that includes partition walls and accommodation guide holes, along with preform solder having bent portions, prevents preform solder separation by restricting its position and preventing it from moving out of designated areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the preform solder is moved by a conveyor during manufacturing, then the manufacturing process can be automated and productivity is improved, but the preform solder may separate from its designated position due to inertia causing soldering defects

Engineering Contradiction:
Improveautomation of manufacturing processVSAvoidposition accuracy of preform solder
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The preform solder is divided into multiple segments by creating bent portions at regular intervals along its length. This segmentation allows each segment to be independently constrained by the guide jig's accommodation holes, preventing the entire preform solder from shifting as a single unit during conveyor movement, thus maintaining position accuracy while enabling automated handling

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The guide jig serves as an intermediary component between the preform solder and the conveyor system. It provides physical constraints through accommodation holes that guide and restrict the movement of preform solder, ensuring it remains in the correct position during automated transport without requiring direct control mechanisms on the conveyor itself

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If components are stacked on the preform solder, then the assembly process is efficient, but it becomes difficult to visually detect preform solder separation leading to undetected soldering defects

Engineering Contradiction:
Improveefficiency of assembly processVSAvoiddetectability of preform solder separation
Core Design Contradiction:
ProductivityVSDifficulty of detecting and measuring

Solution Approach 1:

The preform solder is designed with bent portions that create visible geometric features. These bent portions serve as visual indicators that can be seen even when components are stacked on top, allowing operators to detect separation issues without requiring direct line-of-sight to the entire preform solder length, thus maintaining detectability while preserving assembly efficiency

Inventive Principle:
Principle #32Color changes

3Adaptability or versatility

If the preform solder is made flexible to accommodate positioning, then it can adapt to the substrate, but it becomes more prone to separation and deformation during movement

Engineering Contradiction:
Improveadaptability to substrateVSAvoidstability of preform solder position
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

By dividing the preform solder into segmented portions with bends at intervals, the design allows localized flexibility at each bent section for adaptation while the overall structure maintains stability. Each segment is constrained by guide jig holes, preventing cumulative displacement that would occur with a completely flexible single-piece design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bent portions are pre-formed in advance during manufacturing, creating predetermined flexibility points. This preliminary structuring allows the preform solder to naturally conform to the substrate at these predetermined locations while maintaining rigidity elsewhere, preventing unwanted deformation during conveyor movement

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentEP4645384A1Transport apparatus for semiconductor manufacturing
Publication Date: 2025.11.05 HYUNDAI MOBIS CO LTD
  • EP4645384A1 patent drawingFigure 1~2
  • EP4645384A1 patent drawingFigure 3
  • EP4645384A1 patent drawingFigure 4

AI summary

A transfer apparatus for semiconductor manufacturing, the transfer apparatus including: a carrier configured to move; a substrate disposed on the carrier; a guide jig disposed above an upper surface of the substrate, the guide jig including a plurality of partition walls and a plurality of accommodation guide holes partitioned by the plurality of partition walls; and a preform solder disposed on the upper surface of the substrate, the preform solder including a plurality of bent portions, wherein the plurality of bent portions include a first bent portion formed adjacent to one end of a body; and a second bent portion formed adjacent to the other end of the body.