Solderable Circuit Board Module System with Frame-Shaped Contact Region
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Solution Overview
Problem
Existing circuit board connection methods, such as plug-in connectors and soldering, face challenges like high costs, construction height, reliability issues, and mechanical stress, particularly in demanding applications like automotive microelectronics, where variations in humidity, temperature, and contamination can cause failures.
Innovation Solution
A solderable circuit board module system with a first module having a frame-shaped contact region on the underside and a second module with additional solder connection contacts arranged as an outer frame, allowing for scalable sizes and standardization, improved stability, and efficient grounding, while using a multi-layer structure with extensive grounding layers for enhanced electromagnetic compatibility and low construction height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If plug-in connectors are used for connecting module circuit boards to motherboards, then ease of replacement is improved, but construction height increases and reliability deteriorates under mechanical stress
Solution Approach 1:
The contact region is segmented into a frame-shaped structure with multiple individual contact points distributed around the perimeter, allowing mechanical stress to be distributed across multiple discrete locations rather than concentrated at single connector points
Solution Approach 2:
The connection interface transitions from vertical plug-in connectors to a planar frame-shaped contact region on the circuit board underside, eliminating the need for vertical connector housings and reducing construction height while maintaining connection functionality
2Reliability
If solder beads are applied for each contact point, then connection reliability is improved, but construction height increases and manufacturing complexity increases
Solution Approach 1:
The solder beads are completely removed from the design, replacing them with solder paste applied directly to the frame-shaped contact region, eliminating the need for separate solder bead application steps and reducing construction height
Solution Approach 2:
The contact region and solder application area are merged into a single integrated frame-shaped structure, combining the functions of electrical contact and solder attachment in one planar element
3Adaptability or versatility
If multiple different module designs are created for different applications, then adaptability is improved, but development effort increases
Solution Approach 1:
The frame-shaped contact region serves as a universal interface that can accommodate different module sizes and configurations by varying only the number and arrangement of contact points within the same fundamental frame structure, enabling one design to serve multiple applications
Solution Approach 2:
Different regions of the frame-shaped contact region can be assigned different contact densities or patterns tailored to specific local requirements, while maintaining the overall universal frame structure that enables adaptability across different module types
Data Source
AI summary
A solderable circuit board module system includes at least a first solderable circuit board module and a second solderable circuit board module, wherein the first solderable circuit board module has a first module circuit board having a top side and an underside provided for placement on a motherboard, wherein on the underside of the first module circuit board, solder connection contacts are arranged in a first frame-shaped contact region around a central middle section, which is free of connection contacts. The second solderable circuit board module has additional solder connection contacts, which form an outer frame around the first frame-shaped contact region, as a second group.