Solderable Fiber Optic Transceiver Thermal Mismatch
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Solution Overview
Problem
Fiber optic modules face challenges during solder reflow assembly due to thermal mismatch and contamination risks, as plastic components deform and lenses can become misaligned or contaminated, affecting the optical coupling and electrical interface.
Innovation Solution
A solderable fiber optic transceiver device is designed with a connector guide, lens seal, collimating lens, and transparent carrier, featuring sealed optical and electrical paths, thermal interface, and materials with matched thermal expansion coefficients, along with a removable fiber optic connector for alignment and protection against contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic components are used for housing and alignment, then ease of manufacture and cost are improved, but thermal expansion mismatch causes deformation and misalignment during solder reflow
Solution Approach 1:
The device is divided into separate modules: a solderable transceiver package containing temperature-compensated optical components, and a separate fiber optic connector. The transceiver package is assembled and sealed before solder reflow, isolating sensitive optical components from thermal stress, while the connector is attached afterward to avoid exposure to high temperatures and flux.
Solution Approach 2:
A sealed transceiver package acts as an intermediary barrier between the solder reflow environment and the sensitive optical components. The package includes a lid and seal that create a protected internal environment, preventing flux and moisture from contaminating optical surfaces while allowing the device to be soldered to the PCB.
2Adaptability or versatility
If fiber optic connector is used for electrical interface, then adaptability and connectivity are improved, but contamination from solder flux and moisture affects optical path
Solution Approach 1:
The system separates the electrical interface (solderable transceiver package) from the optical interface (fiber optic connector). The transceiver package is sealed and soldered to the PCB, protecting internal optical components from flux and moisture. The fiber optic connector is attached to the external port of the sealed package, maintaining optical path integrity while enabling connectivity.
Solution Approach 2:
The sealed transceiver package serves as an intermediary that protects the optical path from contamination. It has a sealed enclosure with an external optical port that accepts the fiber optic connector, allowing optical signals to pass through while preventing flux and moisture from reaching internal optical components.
3Ease of manufacture
If plastic housing is used for fiber optic module, then ease of manufacture is improved, but thermal expansion causes lenses to misalign from fiber or OE devices during high temperature exposure
Solution Approach 1:
The patent changes the material parameters of components exposed to solder reflow from plastic to materials with low thermal expansion coefficients (metal or ceramic). The transceiver package housing, lid, and internal mounting structures are made from these thermally stable materials, preventing misalignment of optical components during high temperature soldering while maintaining ease of manufacture through standardized packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable assembly and operation of fiber optic transceivers in standard semiconductor packages, ensuring high-density optical communications, reduced parasitic electrical interfaces, and compatibility with SMT packaging, while maintaining alignment and protection against thermal and environmental stresses.
Implementation Method 1
Fiber optic modules provide efficient optical coupling between optoelectronic (OE) devices and fibers
Implementation Method 2
a collimating lens in alignment with the optical port and sealed to a bottom portion of the lens seal to prevent external contamination from gases and liquids
Implementation Method 3
a lens seal coupled to a bottom portion of the connector guide; a collimating lens in alignment with the optical port and sealed to a bottom portion of the lens seal to prevent external contamination from gases and liquids
Implementation Method 4
a transparent carrier coupled to a bottom portion of the collimating lens, wherein the transparent carrier has a first electrical wiring, and a second electrical wiring for connection to a higher level substrate
Data Source
AI summary
A fiber optic transceiver that is compatible with packaging into standard semiconductor packages and for SMT packaging, using materials and fabrication procedures that withstand solder assembly processes. The SMT package can have electrical contacts on the exterior of the package for creating electrical conduits to a substrate, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver can be of a non-SMT package configuration, being formed with electrical connection technology that allows direct connection to a substrate with electrical wiring, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver may have solderballs, metal posts or other electrical conduit technology that allows direct electrical connection to the substrate.