Exposed Solderable Heat Spreader for IC Packages
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Solution Overview
Problem
Integrated circuit packages face challenges in efficiently removing heat generated by electronic circuits, with existing thin lateral conductive traces being insufficient and adding complexity to connection requirements.
Innovation Solution
An integrated circuit package design incorporating a thermally-conductive heat spreader with a solderable surface, affixed to the semiconductor die and encapsulated with non-electrically conductive material, allowing for enhanced thermal dissipation and electrical connection to a printed circuit board using conventional surface mount technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If thin lateral conductive traces are used to remove heat, then the device complexity is reduced, but the heat removal efficiency is insufficient
Solution Approach 1:
The patent transitions from lateral (2D) heat conduction through thin traces to vertical (3D) heat spreading through a heat spreader attached to the bottom surface of the die. This dimensional change allows heat to be distributed across a larger area in the vertical direction, significantly improving heat removal efficiency while maintaining simple connection requirements through the substrate.
Solution Approach 2:
The heat spreader serves multiple functions simultaneously: it acts as a thermal conduction path to remove heat from the die, provides mechanical support and stress distribution, and enables simplified electrical connections through the substrate. This multi-functionality resolves the contradiction by improving heat removal without adding complexity.
2Temperature
If a heat spreader with solderable surface is implemented, then the thermal dissipation area is increased, but the device structure becomes more complex
Solution Approach 1:
The patent merges the heat spreader function with the package substrate by making the solderable surface part of the exterior package structure. The heat spreader is integrated into the substrate rather than being a separate attached component, which increases thermal dissipation area while avoiding additional structural complexity from separate mounting hardware or interfaces.
Solution Approach 2:
The solderable surface of the heat spreader serves dual purposes: it provides enhanced thermal dissipation area for heat removal and simultaneously enables conventional surface mount technology connections to the PCB. This multi-functionality allows the structure to achieve both thermal performance and electrical connectivity without adding complexity.
3Ease of operation
If conventional surface mount technology is used for mounting, then the ease of operation is improved, but the heat management capability is limited
Solution Approach 1:
The solderable surface on the heat spreader enables the package to be mounted using conventional surface mount technology, maintaining ease of operation. Simultaneously, the enlarged solderable surface area functions as an extended heat dissipation area, allowing the same structure to provide both simple mounting and enhanced heat management capabilities.
Solution Approach 2:
The patent extends heat dissipation from the traditional die attachment interface to the exterior solderable surface of the package. This dimensional extension allows heat to be dissipated through the mounting interface to the PCB, adding another heat removal pathway while maintaining compatibility with conventional mounting processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases thermal dissipation area and simplifies connection processes, ensuring reliable operation by efficiently managing heat and facilitating easy mounting to a printed circuit board.
Implementation Method 1
The heat spreader is thermally-conductive and has a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface is affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner.
Data Source
Figure 1A~1D
Figure 1E~1H
Figure 1I~1L
AI summary
An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.