Solderable Optical Interconnect Assembly for Compact PCB Integration
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Solution Overview
Problem
Existing QSFP pluggable transceivers occupy large space on printed circuit boards, consume high power, and are limited to edge servers, restricting their use in advanced applications like SmartNICs and OBO due to bandwidth limitations and space constraints.
Innovation Solution
A modular, solderable, compact, high-speed optical interconnect system using fiber-based architecture with integrated VCSELs and photodetectors, designed for direct integration on PCBs, reducing physical footprint and power consumption while enabling high-bandwidth data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If QSFP pluggable transceivers are used for optical connectivity, then optical connection is achieved, but large space is occupied on the printed circuit board
Solution Approach 1:
The patent merges the optical transceiver module directly with the PCB substrate to create an integrated optical interconnect. This integration eliminates the need for separate pluggable transceiver modules, thereby achieving optical connectivity while significantly reducing the space occupied on the PCB.
Solution Approach 2:
The patent replaces the mechanical pluggable transceiver system with a soldered integrated optical interconnect. By substituting the mechanical insertion/removal mechanism with a permanent soldered connection, the design achieves more compact integration and eliminates the space requirements for pluggable module housings and connectors.
2Reliability
If QSFP pluggable transceivers are used, then optical connectivity is provided, but high power consumption occurs
Solution Approach 1:
The patent extracts and eliminates the high-power consumption components associated with pluggable transceiver modules by integrating the optical functionality directly into the PCB. This integration removes the need for separate power management circuits and high-power drivers found in traditional pluggable transceivers.
3Reliability
If QSFP transceivers are mounted on the board, then optical connectivity is achieved, but additional components cannot be integrated on the same board
Solution Approach 1:
The patent merges the optical interconnect functionality directly with the PCB substrate, creating a unified platform that occupies minimal space. This integration frees up board real estate and allows for the addition of other components and circuitry, thereby enhancing design flexibility and adaptability for various applications including SmartNICs and OBO configurations.
4Reliability
If QSFP pluggable transceivers are used, then optical connectivity is provided, but limited bandwidth is available for increased server communications
Solution Approach 1:
The patent changes the fundamental parameters of the optical interconnect by integrating multiple optical channels directly into the PCB substrate. This integration enables higher data rates and increased bandwidth by utilizing parallel optical paths and advanced modulation techniques, thereby supporting the increased server communication demands of modern data centers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-density, low-power data transfer with reduced latency and improved integration, suitable for advanced server networking and computing systems, facilitating seamless compatibility with modern network systems and enhancing scalability.
Implementation Method 1
transmitter module, positioned at the transmitting end of the fiber array unit, comprises a plurality of optical engines for generating a plurality of optical signals
Implementation Method 2
receiver module, positioned at a receiving end of the fiber array unit, comprises a photodetector array for receiving the plurality of optical signals and converting the optical signals into electrical signals
Data Source
Figure 1A
Figure 1B~1C
Figure 2A~2C
AI summary
The present disclosure addresses the problem of large space occupation and high-power consumption in existing pluggable transceiver series by introducing a solderable, compact, high-speed optical interconnect. Current QFSP transceivers occupy excessive space on printed circuit boards, consume more power, and only provide optical connectivity for edge servers. The proposed solution, a modular fiber-based optical interconnect, is designed to bring optics closer to the processor, enabling easier integration on circuit boards and resulting in shorter transmission lines. Falling under the linear pluggable optics category, this technology is gaining traction due to its power savings and enhanced link performance, which are essential for data centres and near-edge cloudlets.