Soldered Beam Connection Structure for Fast Optical Scanner Assembly

The patent replaces the chemical bonding mechanism of adhesives with a mechanical connection system. The beam includes protrusions that fit into recesses on the substrate, creating a mechanical interlock that provides immediate structural strength without requiring chemical hardening time. This mechanical substitution resolves the contradiction by eliminating the waiting period for adhesive hardening while maintaining strong bonding.

The beam is segmented into multiple functional parts: a body portion, protrusions for mechanical engagement, and a conductive portion for electrical connection. This segmentation allows the mechanical connection (protrusions) to provide immediate structural strength while the conductive portion can be separately optimized for electrical conductivity, resolving the time-strength contradiction by decoupling structural and electrical functions.

The patent merges multiple functions into the beam structure: mechanical support through the beam body, electrical conductivity through the conductive portion, and positional alignment through the protrusions. This merging of functions creates a unified connection system that simultaneously achieves mechanical strength and electrical conductivity, resolving the reliability-strength contradiction by integrating rather than separating these requirements.

The beam employs composite construction with different portions optimized for different functions: the beam body provides mechanical strength, while the conductive portion ensures electrical connectivity. This composite approach allows each portion to be optimized independently, achieving both high bonding strength and reliable electrical connection without the limitations of using a single material for both purposes.