Soldered Interconnection Pads for Reliable Electronic Module Assembly

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Solution Overview

Problem

Current methods for manufacturing electronic modules, such as smart cards and electronic passports, are complex and costly, with inadequate integration and electrical connection to antennas, leading to unreliable connections.

Innovation Solution

The method involves soldering wider interconnection pads directly onto chip pads, allowing for ultrasonic welding and thermo-compression connections, with protruding solder strips and loop wires for improved mechanical strength and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional wire welding methods are used to connect chip pads to antenna pads, then the manufacturing process is simpler, but the electrical connection reliability is insufficient

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces conventional wire welding (mechanical/thermal process) with a direct soldering process using solder strips. This substitution improves electrical connection reliability by creating direct metallurgical bonds between chip pads and antenna pads, eliminating the intermediate wire connection that prone to failure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces intermediate connection elements (solder strips with protruding portions) that segment the connection process. These strips are first attached to chip pads, then subsequently connected to antenna pads, allowing for more reliable multi-step soldering connections rather than attempting complex direct connections.

Inventive Principle:

Principle #1Segmentation

2Reliability

If wider interconnection pads are soldered directly onto chip pads, then the electrical connection is more reliable, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveconnection reliabilityVSAvoidease of manufacturing

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by pre-attaching solder strips to chip pads before final assembly. The protruding portions of the solder strips are prepared in advance, allowing for easier and more reliable subsequent soldering to antenna pads. This preliminary preparation simplifies the overall manufacturing despite the added component.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The solder strips act as intermediary elements between chip pads and antenna pads. These intermediaries facilitate reliable electrical connections by providing dedicated soldering surfaces, making the manufacturing process more controllable and reliable despite the additional step.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If protective resin is applied to chip pads before connection, then the wires are better retained during sawing, but the connection process becomes more complex

Engineering Contradiction:

Improvewire retention stabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts the protective function from the resin application step by using the solder strips themselves as the primary retention and protective element. The protruding portions of the solder strips provide mechanical retention during sawing without requiring additional protective resin, thereby simplifying the overall process.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process, enhances the integration of electronic modules with electrical circuits, and ensures reliable and robust electrical connections, facilitating easier handling and assembly.

Implementation Method 1

soldering interconnection pads or protruding interconnection portions directly on the chip pads

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 2

interconnections by ultrasonic welding and/or thermo compression of the wired circuits

Methodology Applied

Scientific EffectUltrasonic welding: Ultrasonic Vibration

Implementation Method 3

interconnections by ultrasonic welding and/or thermo compression of the wired circuits

Methodology Applied

Scientific EffectThermo compression: Compression

Data Source

PatentEP3427190B1Method for manufacturing a module with an integrated circuit chip and device comprising such a module

Publication Date: 2023.10.04 THALES DIS FRANCE SA

Figure 1~2D
Figure 3~4
Figure 4A~4E

AI summary

A method for producing a device (1) comprising or constituting an electronic module (1A, 1B, 1C), said module comprising an integrated circuit chip (12) having electrical contact pads (12a, 12b), an insulating material (2) covering at least each pad (12a, 12b), and a projecting interconnection portion (31a, 32a) of an electrical element, connected to each contact pad and extending outwards. The method is characterised in that each projecting interconnection portion (31a, 32a) is configured to have an interconnection width greater than 100 μm or greater than or equal to the width of each electrical contact pad (12a, 12b). The invention also relates to a module obtained thereby and to a device comprising same.