Soldered Joint Wire Bend for Void Prevention
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Solution Overview
Problem
The existing method of flattening wires for soldering results in reduced solder collection at the contact point, leading to void formation and weakened soldered joints due to insufficient solder quantity and distribution.
Innovation Solution
A wire with a shorter bearing portion and angled bend (10° to 90°) is used, allowing improved solder wetting and distribution, and optionally a flattened portion with a rounded shape for enhanced contact and insulation, ensuring a larger solder amount and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wire is flattened at the end to be soldered, then the device is easier to hold during dip-soldering, but less solder collects at the contact point leading to void formation and reduced joint strength
Solution Approach 1:
The wire end is divided into distinct functional segments: a flattened bearing portion for mechanical support and ease of handling, followed by a rounded portion for optimal solder collection. This segmentation allows each segment to fulfill its specific function without compromising the other, resolving the contradiction between ease of operation and solder quantity.
Solution Approach 2:
Different portions of the wire end are given different geometric qualities: the bearing portion is flattened to provide structural support and handling ease, while the solder-contacting portion is rounded to maximize solder wetting and collection. This local differentiation of properties allows simultaneous optimization of both handling ease and solder quantity.
2Strength
If the wire is flattened to increase bearing surface, then the hold of the device during soldering is improved, but the quantity of solder that can collect is reduced
Solution Approach 1:
The wire end structure is segmented into a flattened bearing portion for mechanical strength and a separate rounded portion for solder collection. This segmentation allows the bearing surface to provide structural support while the rounded portion maximizes solder capacity, resolving the contradiction between strength and solder quantity.
Solution Approach 2:
The wire end geometry transitions from a two-dimensional flattened surface to a three-dimensional rounded form. This dimensional change allows the wire to maintain a large bearing surface area for strength while creating a volumetric structure that can hold more solder, resolving the contradiction between strength and solder quantity.
3Ease of manufacture
If sharp corners are present on the flattened wire portion, then manufacturing is simpler, but solder distribution is non-uniform leading to voids
Solution Approach 1:
The wire end is given a rounded or spheroidal geometry instead of sharp corners. This curvature eliminates stress concentration points, ensures uniform solder flow and distribution during dipping, and prevents void formation. The rounded shape is achieved through standard manufacturing processes like firing or molding, maintaining ease of manufacture while significantly improving solder distribution uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the stability and strength of the soldered joint by increasing solder collection and distribution, preventing voids and ensuring reliable electrical connections.
Implementation Method 1
improved solder wetting of the wire is achieved in a wire portion with a gap relative to the contact surface
Data Source
AI summary
An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.