Soldering Airflow Baffle Layout for Uniform Hot Gas Distribution

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Solution Overview

Problem

Conventional soldering apparatuses experience nonuniform gas flow rates through holes, leading to inadequate dispersion of hot air and increased pressure loss, which hinders uniform heating of objects during the soldering process.

Innovation Solution

A soldering apparatus with a blowing unit featuring a centrifugal fan, a first baffle plate, and a heater, where the first baffle plate guides gas to ensure a uniform flow rate through the first blowing port by altering the gas flow direction and distributing it uniformly across the port.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If gas is blown through a hole in the case without dispersion, then the structure is simple, but the flow rate of hot air blown through small holes of the panel to the object to be heated becomes nonuniform

Engineering Contradiction:
Improvestructure simplicityVSAvoidflow rate uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

A baffle plate is introduced as an intermediary component between the blowing port and the panel. The baffle plate disperses the gas flow before it reaches the panel, ensuring uniform distribution of hot air to the object being heated while maintaining structural simplicity

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If a baffle plate is used to disperse the blown gas, then the flow rate uniformity is improved, but the pressure loss remarkably increases

Engineering Contradiction:
Improveflow rate uniformityVSAvoidpressure loss
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The blowing port is designed with specific geometric parameters (cross-sectional area, shape, and position) that are optimized to naturally disperse gas flow while minimizing pressure loss. By carefully controlling the flow parameters at the source, uniform distribution is achieved without requiring additional dispersion components that would increase energy loss

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If the flow rate of gas through the hole is nonuniform, then the structure is simple, but the gas cannot be sufficiently dispersed and uniform blowing to the object is not achieved

Engineering Contradiction:
Improvestructure simplicityVSAvoiddispersion effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The gas flow is pre-conditioned at the blowing port through optimized geometric design before reaching the panel. The blowing port's cross-sectional area and shape are specifically designed to create uniform flow distribution in advance, ensuring reliable dispersion effectiveness without complex additional structures

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves a more uniform gas flow through the first blowing port at each position, enhancing the uniformity of hot air distribution and reducing pressure loss, thereby improving the soldering process efficiency.

Implementation Method 1

a fan housed in the first blowing chamber to blow the gas in a centrifugal direction

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Implementation Method 2

a heater that heats the gas

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS11311956B2Soldering apparatus
Publication Date: 2022.04.26 SENJU METAL IND CO LTD
  • US11311956B2 patent drawing
  • US11311956B2 patent drawing
  • US11311956B2 patent drawing

AI summary

Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port. The soldering apparatus according to the present disclosure is a soldering apparatus that performs soldering, including a blowing unit that supplies gas to an object, wherein the blowing unit includes a case including a first blowing chamber, a fan housed in the first blowing chamber to blow the gas in a centrifugal direction, a first baffle plate, and a heater that heats the gas or a cooling unit that cools the gas, the case includes a first wall that faces the fan in an axial direction of the fan, a second wall that faces the first wall, and an inner wall connecting the first wall and the second wall, the first wall, the second wall and the inner wall define the first blowing chamber, in the first wall, a first blowing port is formed, and the first baffle plate is disposed in the first blowing chamber to guide part of the gas blown from the fan to the first blowing port.