Soldering Heat Treatment Chamber Segmentation
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Solution Overview
Problem
Existing methods for temperature treatment of workpieces, particularly in soldering, require frequent cleaning due to condensation of volatile solder material vapors in cooling zones, leading to interrupted operations and production losses.
Innovation Solution
A method and device that utilize a condensation device to separate heating and cooling chamber regions, preventing condensation in the cooling zone by precipitating vapors, allowing for continuous operation and increased production output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the component is heated and cooled in a single process chamber, then the device structure is simple, but volatile solder material vapor condenses in the cooling zone and forms deposits requiring frequent cleaning
Solution Approach 1:
The process chamber is divided into two separate chambers: a heating chamber for heating and melting the solder material, and a cooling chamber for cooling the component. This segmentation prevents vapor condensation in the cooling zone by physically separating it from the heating zone, eliminating the need for frequent cleaning and enabling continuous operation.
Solution Approach 2:
A bridging element connects the heating chamber and cooling chamber, allowing thermal energy to be transferred from the heating chamber to the cooling chamber without direct vapor contact. This intermediary structure enables heat transfer while maintaining separation between the chambers, preventing condensation deposits.
2Reliability
If frequent cleaning is performed to remove condensation deposits, then the cooling zone remains functional, but operation is repeatedly interrupted causing production losses
Solution Approach 1:
By separating the heating and cooling processes into different chambers, the cooling chamber remains free from vapor condensation deposits. This segmentation ensures continuous functionality of the cooling zone without requiring operational interruptions for cleaning, thereby eliminating production losses.
3Productivity
If the condensation device is positioned to separate chamber areas during heating, then vapor condensation is prevented in the cooling zone, but the device structure becomes more complex
Solution Approach 1:
The condensation device is designed to be movable between a ready position and a partition wall position. During heating operations, it moves to the partition wall position to separate the chambers and prevent condensation. During cooling operations, it returns to the ready position. This dynamic positioning enables continuous operation while managing structural complexity through controlled movement rather than permanent complex structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables continuous operation with reduced cleaning intervals, enhancing production output by maintaining a constant temperature and using a condensation device to prevent condensation, thus minimizing temperature gradients and protecting soldering partners from oxidation.
Implementation Method 1
the condensation device effective between the chamber areas precipitates the volatile evaporations produced during the heating process on the condensation device, which acts like a protective shield and prevents condensation in the cooled chamber area
Implementation Method 2
heating is carried out with a heating device
Implementation Method 3
cooling with a cooling device
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The invention relates to a method and a device (10) for the heat treatment of workpieces (19) or components, especially for producing a soldered connection between a solder material and at least one component or workpiece used as a solder material carrier by melting the solder material arranged on the solder material carrier. According to the invention, the heating and subsequent cooling of at least one component is carried out in a process chamber (13, 14) sealed from the outer surroundings. The component (19) is heated and cooled in two regions (13, 14) of the process chamber (12), which can be separated from each other by a condensation device (15).