Soldering Device Computer Unit One-Wire Sensor Integration
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Solution Overview
Problem
Generic soldering devices face challenges in regulating heating power due to difficulties in recording and transmitting environmental conditions, often requiring complex sensor connections and additional components that are inflexible and costly.
Innovation Solution
A soldering device with a computer unit connected to sensors, using a one-wire principle for communication and power supply, allowing for flexible sensor integration and minimal wiring, enabling efficient regulation of heating current based on multiple temperature measurements and reducing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor connections are led out of the soldering device to an external control unit, then environmental conditions can be recorded, but the device complexity and wiring effort increase
Solution Approach 1:
The patent integrates the computer unit directly into the soldering device housing, combining the control unit and sensor processing capabilities into a single integrated system. This eliminates the need for separate external control units and complex interconnections, while maintaining the ability to record environmental conditions through integrated sensors.
Solution Approach 2:
The computer unit serves multiple functions: it processes sensor signals from temperature sensors, records environmental conditions, controls the heating element, and provides a user interface. This multi-functionality consolidates what would otherwise require separate components, reducing overall system complexity.
2Measurement precision
If multiple sensors are used to measure temperature at different locations, then measurement precision improves, but the quantity of wiring and device complexity increase
Solution Approach 1:
Multiple sensor connections are merged and led together in a bundled arrangement through the housing wall. This consolidates what would otherwise be separate individual wiring paths into a single organized connection point, reducing the visual and physical complexity of wiring while maintaining multiple temperature measurement capabilities.
3Device complexity
If an external control unit is used to process sensor signals, then the soldering device structure is simplified, but the overall system complexity and connection requirements increase
Solution Approach 1:
The computer unit is integrated within the soldering device housing, merging the control unit and sensor processing capabilities into a single unit. This eliminates the need for separate external control units and complex interconnections, while maintaining the ability to record environmental conditions.
4Reliability
If sensor connections are made with multiple leads, then signal transmission reliability improves, but electromagnetic interference and data transmission errors increase
Solution Approach 1:
Multiple sensor connections are merged and led together in a bundled arrangement, which provides shielding and reduces electromagnetic interference between individual sensor leads. This consolidated approach maintains signal integrity while minimizing the harmful electromagnetic effects that would occur with separate, unshielded wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides flexible and cost-effective sensor integration, minimizing wiring effort, enhancing reliability, and reducing the risk of data transmission errors, while allowing for efficient heating current regulation and protection of components.
Implementation Method 1
The heating element (06) can be supplied with heating current (07, 08)
Implementation Method 2
At least one thermocouple (06, 07, 08) is formed between the heating element (06) and the heating current leads (07, 08), at which at least one thermal voltage can be tapped
Data Source
Figure 1
AI summary
The invention relates to a soldering device (01) for soldering workpieces, wherein the soldering device (01) has a least one heating element (06), at least two heating current leads (07, 08) and at least one sensor (05, 06, 07, 08, 09, 10, 11, 13), and wherein the heating element can be supplied with a heating current via the heating current leads (07, 08), and wherein the soldering device (01) has a computer unit (12), and wherein the sensor (05, 06, 07, 08, 09, 10, 11, 13) is connected to the computer unit (12).