Soldering Nozzle Baffle Plate for Spatter Reduction
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Solution Overview
Problem
Existing soldering devices face issues with solder spattering and functional failures due to excess solder flowing back into the melting pot, especially under protective gas atmospheres like nitrogen, where the solder forms large balls or spatters, leading to potential errors in soldered assemblies.
Innovation Solution
A device with a baffle plate discharge system is introduced between the soldering nozzles and the carrier, reducing the drop height of excess solder and preventing spatter formation by directing it back into the crucible, and optionally using a downpipe for controlled drainage and a gassing cap to minimize gas consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If excess solder flows back into the melting pot under gravity, then solder drainage is simple, but spatter formation occurs leading to functional failures
Solution Approach 1:
A baffle plate is introduced as an intermediary element between the soldering nozzles and the melting pot. This baffle plate serves as a mediator that intercepts excess solder before it falls directly into the melting pot, preventing spatter formation while maintaining simple drainage. The baffle plate is positioned to receive solder from the nozzles and guide it safely back into the melting pot without causing harmful splashes.
2Reliability
If soldering takes place under protective gas (nitrogen), then oxidation is prevented, but solder forms large balls and spatters increasing failure risk
Solution Approach 1:
The baffle plate acts as a mediator that intercepts solder in the protective gas atmosphere before it can form large balls and spatter. By providing a controlled surface for solder to contact and redirect, the baffle plate prevents the uncontrolled spatter formation that occurs when solder falls directly into the melting pot under nitrogen atmosphere, while maintaining the protective gas benefits.
Solution Approach 2:
The invention changes the physical parameters of solder flow by introducing a baffle plate that alters the flow path, velocity, and impact characteristics. This modifies how solder behaves in the protective gas atmosphere, preventing the formation of large solder balls and spatters while maintaining reliable soldering under nitrogen protection.
3Reliability
If sloping run-off or baffle plates are provided on soldering nozzles, then spatter formation is reduced, but the solution is not compatible with multiple closely spaced nozzles
Solution Approach 1:
Instead of providing individual baffle plates for each nozzle (which would be complex and space-consuming), the invention merges the baffle function into a single common structure that serves multiple closely spaced nozzles. This unified baffle plate design maintains spatter reduction effectiveness while being compatible with dense multi-nozzle arrangements, solving the adaptability problem.
Solution Approach 2:
The invention transitions from individual nozzle-level spatter control to a collective array-level control approach. By positioning a common baffle plate at the array level rather than on each individual nozzle, the solution achieves spatter reduction for multiple closely spaced nozzles without the complexity of individual plates, effectively using a different spatial dimension for the solution.
4Reliability
If baffle plate is introduced to reduce drop height and prevent spatter, then assembly reliability improves, but device complexity increases
Solution Approach 1:
The baffle plate is introduced as a simple intermediary element that provides spatter prevention without requiring complex mechanisms. It is a passive structural component that intercepts solder and guides it back to the melting pot, achieving reliability improvement with minimal added complexity compared to active control systems or complex nozzle modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces spatter formation and ensures reliable solder drainage, preventing errors and maintaining assembly integrity, even under protective gas conditions.
Implementation Method 1
a separating plane is drawn in between the tip of the soldering nozzle and the carrier and thus also between the tip of the soldering nozzle and the level of the molten solder in the crucible, which reduces the drop height of the solder and thus its kinetic energy
Implementation Method 2
molten solder is conveyed from the soldering pot through the soldering nozzles to the components to be soldered by means of a conveying device which can have a solder pump and a riser pipe
Data Source
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AI summary
The invention relates to a device for soldering electrical or electronic components onto a printed circuit board, comprising a soldering nozzle arrangement having at least one carrier (04, 16, 38) on which at least one soldering nozzle (05, 17, 39) is arranged, wherein the soldering nozzle arrangement is arranged above a solder pot (01) and wherein molten solder (06) is conveyed from the solder pot (01) through the soldering nozzle (05, 17, 39) to the components to be soldered by means of a conveying device, with at least one drain device (09, 19, 44) for excess solder that has escaped from the soldering nozzle (05, 17, 39), the drain device (09, 19, 44) being arranged between the tip of the soldering nozzle (05, 17, 39) and the carrier (04, 16, 38), wherein the drain device (09, 19, 44) has at least one impact plate (10, 26, 45) which substantially surrounds the soldering nozzle (05, 17, 39).